Jennifer A. Byford
Jennifer A. Byford
MIT Lincoln Laboratory
Подтвержден адрес электронной почты в домене msu.edu - Главная страница
Название
Процитировано
Процитировано
Год
Demonstration of RF and microwave passive circuits through 3-D printing and selective metalization
JA Byford, MIM Ghazali, S Karuppuswami, BL Wright, P Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (3 …, 2017
562017
Metamaterial inspired periodic structure used for microfluidic sensing
JA Byford, KY Park, P Chahal
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1997-2002, 2015
302015
Affordable terahertz components using 3D printing
A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2071-2076, 2015
252015
3D printed metalized-polymer UWB high-gain Vivaldi antennas
MIM Ghazali, KY Park, JA Byford, J Papapolymerou, P Chahal
2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016
242016
Aerosol-jet printed quasi-optical terahertz filters
C Oakley, A Kaur, JA Byford, P Chahal
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 248-253, 2017
172017
3D printed high frequency coaxial transmission line based circuits
M Craton, JA Byford, V Gjokaj, J Papapolymerou, P Chahal
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1080-1087, 2017
172017
3D printed out-of-plane antennas for use on high density boards
MIM Ghazali, JA Byford, S Karuppuswami, A Kaur, J Lennon, P Chahal
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1835-1842, 2017
162017
Frequency reconfigurable patch antenna array
JA Byford, KY Park, P Chahal, EJ Rothwell
Electronics Letters 51 (21), 1628-1630, 2015
142015
Fabrication of terahertz components using 3D printed templates
JA Byford, Z Purtill, P Chahal
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 817-822, 2016
92016
Ultra-wideband hybrid substrate integrated ribbon waveguides using 3D printing
JA Byford, P Chahal
2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016
72016
Investigation of modulation-capable silicon waveguides for efficient on-wafer terahertz interconnects
JC Myers, A Kaur, JA Byford, P Chahal
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1010-1016, 2015
32015
Millimeter wave and terahertz dielectric probe microfluidic sensors
P Chahal, JA Hejase, S Shane, KY Park, A Kaur, J Byford
2014 39th International Conference on Infrared, Millimeter, and Terahertz …, 2014
32014
Demonstration of substrate integrated ribbon waveguide using 3-D printing
JA Byford, P Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018
22018
Additively manufactured frequency selective structures on curved surfaces
JA Byford, C Oakley, P Chahal
2018 48th European Microwave Conference (EuMC), 671-674, 2018
22018
Broad-band dielectric probes for on-wafer characterization of terahertz devices
JA Byford, P Chahal
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2367-2373, 2018
22018
A Volatile Molecular Sensor Using Terahertz Resonators on Porous Substrates
S Karuppuswami, JA Byford, P Chahal
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2295-2300, 2018
12018
A polyjet 3D printed alternative for package to RFIC interconnects
M Craton, JA Byford, J Papapolymerou, P Chahal, JD Arbrecht
2017 47th European Microwave Conference (EuMC), 500-503, 2017
12017
Common misunderstandings and challenges in learning Gauss’s Law in a junior level electromagnetic engineering course
JA Byford, P Chahal
46th International Conference on Engineering Pedagogy, 27-29 September 2017 …, 2017
12017
Design of Wideband On-Board Terahertz Interconnects, Circuits and Sensors
JA Byford
Michigan State University, 2018
2018
College of Engineering Committee List 2014-2015
AS BAE, MH CHEMS, NB CEE, JV DE, LK DE, MK DE, MJS DE, TW DE, ...
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