| Demonstration of RF and microwave passive circuits through 3-D printing and selective metalization JA Byford, MIM Ghazali, S Karuppuswami, BL Wright, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (3 …, 2017 | 58 | 2017 |
| Metamaterial inspired periodic structure used for microfluidic sensing JA Byford, KY Park, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1997-2002, 2015 | 36 | 2015 |
| 3D printed metalized-polymer UWB high-gain Vivaldi antennas MIM Ghazali, KY Park, JA Byford, J Papapolymerou, P Chahal 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 27 | 2016 |
| Affordable terahertz components using 3D printing A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2071-2076, 2015 | 27 | 2015 |
| Aerosol-jet printed quasi-optical terahertz filters C Oakley, A Kaur, JA Byford, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 248-253, 2017 | 19 | 2017 |
| 3D printed high frequency coaxial transmission line based circuits M Craton, JA Byford, V Gjokaj, J Papapolymerou, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1080-1087, 2017 | 18 | 2017 |
| Frequency reconfigurable patch antenna array JA Byford, KY Park, P Chahal, EJ Rothwell Electronics Letters 51 (21), 1628-1630, 2015 | 17 | 2015 |
| 3D printed out-of-plane antennas for use on high density boards MIM Ghazali, JA Byford, S Karuppuswami, A Kaur, J Lennon, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1835-1842, 2017 | 16 | 2017 |
| Fabrication of terahertz components using 3D printed templates JA Byford, Z Purtill, P Chahal 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 817-822, 2016 | 9 | 2016 |
| Ultra-wideband hybrid substrate integrated ribbon waveguides using 3D printing JA Byford, P Chahal 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 7 | 2016 |
| Additively manufactured frequency selective structures on curved surfaces JA Byford, C Oakley, P Chahal 2018 48th European Microwave Conference (EuMC), 671-674, 2018 | 3 | 2018 |
| Broad-band dielectric probes for on-wafer characterization of terahertz devices JA Byford, P Chahal 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2367-2373, 2018 | 3 | 2018 |
| Investigation of modulation-capable silicon waveguides for efficient on-wafer terahertz interconnects JC Myers, A Kaur, JA Byford, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1010-1016, 2015 | 3 | 2015 |
| Millimeter wave and terahertz dielectric probe microfluidic sensors P Chahal, JA Hejase, S Shane, KY Park, A Kaur, J Byford 2014 39th International Conference on Infrared, Millimeter, and Terahertz …, 2014 | 3 | 2014 |
| Demonstration of substrate integrated ribbon waveguide using 3-D printing JA Byford, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 2 | 2018 |
| Common misunderstandings and challenges in learning Gauss’s Law in a junior level electromagnetic engineering course JA Byford, P Chahal 46th International Conference on Engineering Pedagogy, 27-29 September 2017 …, 2017 | 2 | 2017 |
| A Volatile Molecular Sensor Using Terahertz Resonators on Porous Substrates S Karuppuswami, JA Byford, P Chahal 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2295-2300, 2018 | 1 | 2018 |
| A polyjet 3D printed alternative for package to RFIC interconnects M Craton, JA Byford, J Papapolymerou, P Chahal, JD Arbrecht 2017 47th European Microwave Conference (EuMC), 500-503, 2017 | 1 | 2017 |
| Design of Wideband On-Board Terahertz Interconnects, Circuits and Sensors JA Byford Michigan State University, 2018 | | 2018 |
| College of Engineering Committee List 2014-2015 AS BAE, MH CHEMS, NB CEE, JV DE, LK DE, MK DE, MJS DE, TW DE, ... | | |
Premjeet ChahalProfessor, Michigan State UniversityПодтвержден адрес электронной почты в домене msu.edu
