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Jean-François Morissette
Jean-François Morissette
Research Assistant, Universite de Sherbrooke
Подтвержден адрес электронной почты в домене usherbrooke.ca
Название
Процитировано
Процитировано
Год
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides
T Barwicz, N Boyer, A Janta-Polczynski, JF Morissette, Y Thibodeau, ...
2016 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2016
272016
Novel, high-throughput, fiber-to-chip assembly employing only off-the-shelf components
N Boyer, A Janta-Polczynski, JF Morissette, S Martel, TW Lichoulas, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1632-1639, 2017
192017
Microfabricated neuroaccelerometer: integrating sensing and reservoir computing in MEMS
B Barazani, G Dion, JF Morissette, L Beaudoin, J Sylvestre
Journal of Microelectromechanical Systems 29 (3), 338-347, 2020
172020
Pool boiling experiment of dielectric liquids and numerical study for cooling a microprocessor
O Ghaffari, F Grenier, JF Morissette, M Bolduc, S Jasmin, J Sylvestre
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
132019
A compliant polymer interface with 1.4 dB loss between standard fibers and nanophotonic waveguides
T Barwicz, A Janta-Polczynski, S Takenobu, JF Morissette, B Peng, ...
Frontiers in Optics, FTu1D. 2, 2016
132016
Technology platform for the fabrication of titanium nanostructures
S Ecoffey, M Guilmain, JF Morissette, F Bourque, J Pont, BL Sang, ...
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2011
112011
Sub-micron bondline-shape control in automated assembly of photonic devices
N Boyer, A Janta-Polczynski, JF Morissette, S Kamlapurkar, S Engelmann, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2257-2263, 2016
102016
Localized pool boiling and condensation experiments over functional CPU: Optimizing the overall thermal resistance via different heat transfer scenarios
C Al Sayed, O Ghaffari, F Grenier, W Tong, M Bolduc, JF Morissette, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
82020
Fabrication par lithographie hybride et procede damascene de transistors monoelectroniques a grille auto-alignee
JF Morissette
UNIVERSITE DE SHERBROOKE, 2012
52012
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
O Ghaffari, W Tong, YN Larimi, C al Sayed, A Ganjali, JF Morissette, ...
Journal of Electronic Packaging 143 (4), 2021
42021
Component and chip assembly structure for high yield parallelized fiber assembly
T Barwicz, N Boyer, PF Fortier, A Janta-polczynski, SL Martel, J Morissette
US Patent 9,568,682, 2017
32017
Ultrathin titanium passive devices fabrication
S Ecoffey, JF Morissette, N Jedidi, M Guilmain, C Nauenheim, D Drouin
2011 11th IEEE International Conference on Nanotechnology, 1689-1692, 2011
32011
Neuromorphic metamaterial structures
J Sylvestre, JF Morissette
Materials & Design 210, 110078, 2021
2021
Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process
SB Jemaa, P Gagnon, A Dione, MK Touré, JF Morissette, PM Souare, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 194-200, 2020
2020
In-situ solder surface tension measurements using mechanical resonances
A Ndieguene, JF Morissette, N Normand, J Sylvestre
2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016
2016
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