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Michael J Hill
Michael J Hill
Подтвержден адрес электронной почты в домене intel.com
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Процитировано
Процитировано
Год
FIVR—Fully integrated voltage regulators on 4th generation Intel® Core™ SoCs
EA Burton, G Schrom, F Paillet, J Douglas, WJ Lambert, K Radhakrishnan, ...
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 432-439, 2014
4252014
A 100MHz eight-phase buck converter delivering 12A in 25mm2 using air-core inductors
G Schrom, P Hazucha, F Paillet, DJ Rennie, ST Moon, DS Gardner, ...
APEC 07-Twenty-Second Annual IEEE Applied Power Electronics Conference and …, 2007
1172007
Package inductors for Intel fully integrated voltage regulators
WJ Lambert, MJ Hill, K Radhakrishnan, L Wojewoda, AE Augustine
IEEE transactions on components, packaging and manufacturing technology 6 (1 …, 2015
712015
Power Delivery for High-Performance Microprocessors.
K Aygün, MJ Hill, K Eilert, K Radhakrishnan, A Levin
Intel Technology Journal 9 (4), 2005
682005
A high-Q reconfigurable planar EBG cavity resonator
MJ Hill, RW Ziolkowski, J Papapolymerou
IEEE Microwave and wireless components letters 11 (6), 255-257, 2001
662001
Simulated and measured results from a Duroid-based planar MBG cavity resonator filter
MJ Hill, RW Ziolkowski, J Papapolymerou
IEEE Microwave and guided wave letters 10 (12), 528-530, 2000
582000
A duroid-based planar EBG cavity resonator filter with improved quality factor
H Hsu, MJ Hill, RW Ziolkowski, J Papapolymerou
IEEE antennas and wireless propagation letters 1, 67-70, 2002
502002
High-Q micromachined resonant cavities in a K-band diplexer configuration
MJ Hill, J Papapolymerou, RW Ziolkowski
IEE Proceedings-Microwaves, Antennas and Propagation 148 (5), 307-312, 2001
332001
Embedded capacitors in the next generation processor
Y Min, R Olmedo, M Hill, K Radhakrishnan, K Aygun, M Kabiri-Badr, ...
2013 IEEE 63rd electronic components and technology conference, 1225-1229, 2013
282013
Package embedded inductors for integrated voltage regulators
WJ Lambert, MJ Hill, K Radhakrishnan, L Wojewoda, AE Augustine
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 528-534, 2014
232014
Microprocessor platform impedance characterization using VTT tools
S Chickamenahalli, K Aygun, MJ Hill, K Radhakrishnan, K Eilert, ...
Twentieth Annual IEEE Applied Power Electronics Conference and Exposition …, 2005
232005
A planar X-band electromagnetic band-gap (EBG) 3-pole filter
H Hsu, MJ Hill, J Papapolymerou, RW Ziolkowski
IEEE Microwave and wireless components letters 12 (7), 255-257, 2002
202002
Measurement-to-modeling correlation of the power delivery network impedance of a microprocessor system
K Aygun, MJ Hill, KD Ellert, K Radhakrishnan
Electrical Performance of Electronic Packaging-2004, 221-224, 2004
152004
Magnetic Inductor Arrays for Intel® Fully Integrated Voltage Regulator (FIVR) on 10th generation Intel® Core™ SoCs
M Sankarasubramanian, K Radhakrishnan, Y Min, W Lambert, MJ Hill, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 399-404, 2020
142020
Study of thin-film magnetic inductors applied to integrated voltage regulators
WJ Lambert, MJ Hill, KP O'Brien, K Radhakrishnan, P Fischer
IEEE Transactions on Power Electronics 35 (6), 6208-6220, 2019
142019
Integrated voltage regulator efficiency improvement using coaxial magnetic composite core inductors
K Bharath, K Radhakrishnan, MJ Hill, P Chatterjee, H Hariri, ...
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1286-1292, 2021
102021
Apparatus and method to reduce power losses in an integrated voltage regulator
K Bharath, S Venkataraman, WJ Lambert, MJ Hill, A Slepoy, D Zhong, ...
US Patent 9,753,510, 2017
102017
Package using array capacitor core
KD Eilert, K Radhakrishnan, K Aygun, MJ Hill
US Patent 7,692,284, 2010
102010
Circuit modeling of nonlinear lossy frequency-dependent thin-film magnetic inductors
A Elsherbini, H Braunisch, K O'Brien, MJ Hill
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013
92013
Use condition characterization of MLCCs
LE Wojewoda, MJ Hill, K Radhakrishnan, N Goyal
IEEE transactions on advanced packaging 32 (1), 109-115, 2009
92009
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