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Fredrik Forsberg
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Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
4392013
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
3542015
Integrating mems and ics
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 1-16, 2015
3462015
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
1502016
Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers
X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, H Rödjegård, ...
Nature Electronics 2 (9), 394-404, 2019
1032019
Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications
X Fan, AD Smith, F Forsberg, S Wagner, S Schröder, SSA Akbari, ...
Microsystems & Nanoengineering 6 (1), 17, 2020
742020
Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE (+) dual-cure polymer
F Saharil, F Forsberg, Y Liu, P Bettotti, N Kumar, F Niklaus, T Haraldsson, ...
Journal of Micromechanics and Microengineering 23 (2), 025021, 2013
672013
Suspended graphene membranes with attached silicon proof masses as piezoresistive nanoelectromechanical systems accelerometers
X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, M Östling, ...
Nano letters 19 (10), 6788-6799, 2019
572019
Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs
F Niklaus, A Decharat, F Forsberg, N Roxhed, M Lapisa, M Populin, ...
Sensors and Actuators A: Physical 154 (1), 180-186, 2009
502009
CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-D integration
F Forsberg, A Lapadatu, G Kittilsland, S Martinsen, N Roxhed, AC Fischer, ...
IEEE Journal of Selected Topics in Quantum Electronics 21 (4), 30-40, 2014
422014
Low-cost uncooled microbolometers for thermal imaging
N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ...
Optical sensing and detection 7726, 315-324, 2010
322010
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays
F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ...
Infrared physics & technology 60, 251-259, 2013
252013
High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers
F Forsberg, N Roxhed, P Ericsson, S Wissmar, F Niklaus, G Stemme
TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009
222009
Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays
P Ericsson, AC Fischer, F Forsberg, N Roxhed, B Samel, S Savage, ...
Infrared Technology and Applications XXXVII 8012, 411-420, 2011
212011
Far infrared low-cost uncooled bolometer for automotive use
T Kvisterøy, H Jakobsen, C Vieider, S Wissmar, P Ericsson, U Halldin, ...
Advanced Microsystems for Automotive Applications, 265-278, 2007
172007
High-resolution micropatterning of off-stochiometric thiol-enes (OSTE) via a novel lithography mechanism
F Carlborg, F Saharil, F Forsberg, F Niklaus, W van der Wijngaart, ...
16th International Conference on Miniaturized Systems for Chemistry and Life …, 2012
152012
Exploring the capability of muon scattering tomography for imaging the components in the blast furnace
X Hu, LS Ökvist, E Åström, F Forsberg, P Checchia, G Bonomi, I Calliari, ...
ISIJ International 58 (1), 35-42, 2018
142018
Wafer-level heterogeneous 3D integration for MEMS and NEMS
F Niklaus, M Lapisa, SJ Bleiker, V Dubois, N Roxhed, AC Fischer, ...
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D …, 2012
142012
A comparative study of the bonding energy in adhesive wafer bonding
F Forsberg, F Saharil, T Haraldsson, N Roxhed, G Stemme, ...
Journal of Micromechanics and Microengineering 23 (8), 085019, 2013
132013
Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate
F Forsberg, N Roxhed, G Stemme, F Niklaus
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011
132011
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