| Enantiospecific electrodeposition of a chiral catalyst JA Switzer, HM Kothari, P Poizot, S Nakanishi, EW Bohannan Nature 425 (6957), 490-493, 2003 | 387 | 2003 |
| Epitaxial electrodeposition of zinc oxide nanopillars on single-crystal gold R Liu, AA Vertegel, EW Bohannan, TA Sorenson, JA Switzer Chemistry of Materials 13 (2), 508-512, 2001 | 348 | 2001 |
| Electrodeposited ceramic single crystals JA Switzer, MG Shumsky, EW Bohannan Science 284 (5412), 293-296, 1999 | 271 | 1999 |
| Epitaxial electrodeposition of copper (I) oxide on single-crystal gold (100) EW Bohannan, MG Shumsky, JA Switzer Chemistry of materials 11 (9), 2289-2291, 1999 | 174 | 1999 |
| In Situ Electrochemical Quartz Crystal Microbalance Study of Potential Oscillations during the Electrodeposition of Cu/Cu2O Layered Nanostructures EW Bohannan, LY Huang, FS Miller, MG Shumsky, JA Switzer Langmuir 15 (3), 813-818, 1999 | 163 | 1999 |
| Shape Control in Epitaxial Electrodeposition: Cu2O Nanocubes on InP(001) R Liu, F Oba, EW Bohannan, F Ernst, JA Switzer Chemistry of materials 15 (26), 4882-4885, 2003 | 162 | 2003 |
| Electrochemical self-assembly of copper/cuprous oxide layered nanostructures JA Switzer, CJ Hung, LY Huang, ER Switzer, DR Kammler, TD Golden, ... Journal of the American Chemical Society 120 (14), 3530-3531, 1998 | 157 | 1998 |
| Molybdenum disulfide nanowires and nanoribbons by electrochemical/chemical synthesis Q Li, EC Walter, WE Van der Veer, BJ Murray, JT Newberg, ... The Journal of Physical Chemistry B 109 (8), 3169-3182, 2005 | 153 | 2005 |
| An electrochemical method for CuO thin film deposition from aqueous solution P Poizot, CJ Hung, MP Nikiforov, EW Bohannan, JA Switzer Electrochemical and Solid-State Letters 6 (2), C21, 2002 | 132 | 2002 |
| Thermodynamic to kinetic transition in epitaxial electrodeposition JA Switzer, HM Kothari, EW Bohannan The Journal of Physical Chemistry B 106 (16), 4027-4031, 2002 | 127 | 2002 |
| Evidence that monochloramine disinfectant could lead to elevated Pb levels in drinking water JA Switzer, VV Rajasekharan, S Boonsalee, EA Kulp, EW Bohannan Environmental science & technology 40 (10), 3384-3387, 2006 | 114 | 2006 |
| Potential oscillations during the electrochemical self-assembly of copper/cuprous oxide layered nanostructures JA Switzer, CJ Hung, LY Huang, FS Miller, Y Zhou, ER Raub, ... Journal of materials research 13 (4), 909-916, 1998 | 113 | 1998 |
| Textured NiSe2 Film: Bifunctional Electrocatalyst for Full Water Splitting at Remarkably Low Overpotential with High Energy Efficiency AT Swesi, J Masud, WPR Liyanage, S Umapathi, E Bohannan, ... Scientific reports 7 (1), 2401, 2017 | 110 | 2017 |
| Single source precursors for fabrication of I–III–VI2 thin-film solar cells via spray CVD JA Hollingsworth, KK Banger, MHC Jin, JD Harris, JE Cowen, ... Thin Solid Films 431, 63-67, 2003 | 101 | 2003 |
| Low-temperature electrodeposition of the high-temperature cubic polymorph of bismuth (III) oxide EW Bohannan, CC Jaynes, MG Shumsky, JK Barton, JA Switzer Solid State Ionics 131 (1-2), 97-107, 2000 | 99 | 2000 |
| Epitaxial Electrodeposition of High-Aspect-Ratio Cu2O(110) Nanostructures on InP(111) R Liu, EA Kulp, F Oba, EW Bohannan, F Ernst, JA Switzer Chemistry of materials 17 (4), 725-729, 2005 | 98 | 2005 |
| Electrochemical deposition and characterization of Fe3O4 films produced by the reduction of Fe (III)-triethanolamine HM Kothari, EA Kulp, SJ Limmer, P Poizot, EW Bohannan, JA Switzer Journal of materials research 21 (1), 293-301, 2006 | 97 | 2006 |
| Electrodeposition of quantum‐confined metal/semiconductor nanocomposites JA Switzer, CJ Hung, EW Bohannan, MG Shumsky, TD Golden, ... Advanced Materials 9 (4), 334-338, 1997 | 94 | 1997 |
| Negative differential resistance in electrochemically self-assembled layered nanostructures JA Switzer, BM Maune, ER Raub, EW Bohannan The Journal of Physical Chemistry B 103 (3), 395-398, 1999 | 87 | 1999 |
| Epitaxial electrodeposition of copper (I) oxide on single-crystal copper JK Barton, AA Vertegel, EW Bohannan, JA Switzer Chemistry of materials 13 (3), 952-959, 2001 | 80 | 2001 |
