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Co-authors
- Yu JiTencent AmericaVerified email at udel.edu
- Nianyi LiAssistant Professor, Clemson UniversityVerified email at clemson.edu
- Yuqi DingLouisiana State UniversityVerified email at lsu.edu
- Simron ThapaPh.D., Louisiana State University, 3M R&DVerified email at lsu.edu
- Mingyuan ZhouInnopeak TechnologyVerified email at udel.edu
- Haibin LingSUNY Empire Innovation Professor, Stony Brook UniversityVerified email at cs.stonybrook.edu
- Suren JayasuriyaAssistant Professor, Arizona State UniversityVerified email at asu.edu
- Hsiao-Chun WuLouisiana State UniversityVerified email at ece.lsu.edu
- Sing Bing KangZillow GroupVerified email at ieee.org
- Zhong LiApple IncVerified email at apple.com
- Weidong XiangUniversity of Michigan, DearbornVerified email at umich.edu
- Can ChenUniversity of DelawareVerified email at udel.edu
- Albert W. ReedPh.D., Arizona State UniversityVerified email at asu.edu
- Feng Li (李冯)AppleVerified email at apple.com
- Shi JinShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Ruiyang (Ree) LiuStyle3D ResearchVerified email at shanghaitech.edu.cn
- Costas BuschProfessor, School of Computer and Cyber Sciences, Augusta UniversityVerified email at augusta.edu
- Jingyi YuProfessor, ShanghaiTech University
- Wei YangAssociate Professor, Huazhong University of Science and TechnologyVerified email at hust.edu.cn