| Functionally graded material of 304L stainless steel and inconel 625 fabricated by directed energy deposition: Characterization and thermodynamic modeling BE Carroll, RA Otis, JP Borgonia, J Suh, RP Dillon, AA Shapiro, ... Acta Materialia 108, 46-54, 2016 | 658 | 2016 |
| Developing gradient metal alloys through radial deposition additive manufacturing DC Hofmann, S Roberts, R Otis, J Kolodziejska, RP Dillon, J Suh, ... Scientific reports 4 (1), 5357, 2014 | 353 | 2014 |
| Compositionally graded metals: A new frontier of additive manufacturing DC Hofmann, J Kolodziejska, S Roberts, R Otis, RP Dillon, JO Suh, ZK Liu, ... Journal of Materials Research 29 (17), 1899-1910, 2014 | 282 | 2014 |
| Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints JW Nah, KW Paik, JO Suh, KN Tu Journal of applied physics 94 (12), 7560-7566, 2003 | 168 | 2003 |
| Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper JO Suh, KN Tu, GV Lutsenko, AM Gusak Acta Materialia 56 (5), 1075-1083, 2008 | 134 | 2008 |
| Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect JW Nah, JO Suh, KN Tu, SW Yoon, VS Rao, V Kripesh, F Hua Journal of applied physics 100 (12), 2006 | 121 | 2006 |
| Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu JO Suh, KN Tu, N Tamura Applied Physics Letters 91 (5), 2007 | 113 | 2007 |
| Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature JW Nah, JO Suh, KN Tu Journal of applied physics 98 (1), 2005 | 104 | 2005 |
| Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu JO Suh, KN Tu, N Tamura Journal of Applied Physics 102 (6), 2007 | 96 | 2007 |
| Castable bulk metallic glass strain wave gears: towards decreasing the cost of high-performance robotics DC Hofmann, R Polit-Casillas, SN Roberts, JP Borgonia, RP Dillon, ... Scientific reports 6 (1), 37773, 2016 | 89 | 2016 |
| Mechanism and prevention of spontaneous tin whisker growth KN Tu, J Suh, ATC Wu, N Tamura, CH Tung Materials transactions 46 (11), 2300-2308, 2005 | 46 | 2005 |
| Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects MY Yan, JO Suh, F Ren, KN Tu, AV Vairagar, SG Mhaisalkar, ... Applied Physics Letters 87 (21), 2005 | 45 | 2005 |
| Electromigration study in flip chip solder joints JW Nah, K Chen, JO Suh, KN Tu 2007 Proceedings 57th Electronic Components and Technology Conference, 1450-1455, 2007 | 31 | 2007 |
| A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints JO Suh, KN Tu, N Tamura JOM 58, 63-66, 2006 | 25 | 2006 |
| A study of solder alloy ductility for cryogenic applications A Lupinacci, AA Shapiro, JO Suh, AM Minor 2013 IEEE International Symposium on Advanced Packaging Materials, 82-88, 2013 | 23 | 2013 |
| Effect of electromigration on mechanical behavior of solder joints F Ren, JW Nah, JO Suh, KN Tu, BS Xiong, LH Xu, JHL Pang Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 19 | 2005 |
| Electromigration in Pb-free solder bumps with Cu column as flip chip joints JW Nah, JO Suh, KN Tu, SW Yoon, CT Chong, V Kripesh, BR Su, C Chen 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 13 | 2006 |
| Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni JO Suh, KN Tu, AT Wu, N Tamura Journal of Applied Physics 109 (12), 2011 | 11 | 2011 |
| Tin whisker growth on lead-free solder finishes KN Tu Lead-Free Solder-Interconnect Reliability, 147-163, 2005 | 11 | 2005 |
| Thermal interface materials selection and application guidelines: in perspective of Xilinx Virtex-5QV thermal management J Suh, RP Dillon, S Tseng | 8 | 2015 |
Nobumichi TamuraLawrence Berkeley National LabVerified email at lbl.gov
