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Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
Yanyong LiThe depatement of Applied Physics, Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Yang ChaiUniversity of Southern CaliforniaVerified email at usc.edu
Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
Chun Hin MakThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Longhui (Stephen) ZENGUniversity of California, San DiegoVerified email at ucsd.edu
Zai-Quan XuUniversity of Technology SydneyVerified email at uts.edu.au
Chao Xie(谢超)Anhui UniversityVerified email at ahu.edu.cn
Prof. Feng YanChair Professor of Organic Electronics, Department of Applied Physics, The Hong Kong PolytechnicVerified email at polyu.edu.hk
Huiyu YuanZhengzhou UniversityVerified email at zzu.edu.cn
Di Wu (吴翟)Professor, School of Physics and Microelectronics, Zhengzhou UniversityVerified email at zzu.edu.cn
Gongxun Bai (白功勋)China Jiliang UniversityVerified email at cjlu.edu.cn
Yupeng ZhangShenzhen UniversityVerified email at szu.edu.cn
Professor Charles SuryaDean of School of Engineering, Nazarbayev University, Astana, KazakhstanVerified email at nu.edu.kz
Baoquan SunSoochow University, Institute of Functional Nano & Soft Materials (FUNSOM)Verified email at suda.edu.cn
Qasim KhanUniversity of CalgaryVerified email at ucalgary.ca
Jiasheng QianUniversity of AlbertaVerified email at ualberta.ca
Yao GuoBeijing Institute of TechnologyVerified email at pku.edu.cn
Wei JiDepartment of Physics, Renmin University of ChinaVerified email at ruc.edu.cn
Qiang ZhangTsinghua UniversityVerified email at mails.tsinghua.edu.cn