| FiPy: Partial differential equations with Python JE Guyer, D Wheeler, JA Warren Computing in Science & Engineering 11 (3), 6-15, 2009 | 502 | 2009 |
| Superconformal film growth: Mechanism and quantification TP Moffat, D Wheeler, MD Edelstein, D Josell IBM Journal of Research and Development 49 (1), 19-36, 2005 | 470 | 2005 |
| Superconformal electrodeposition of copper TP Moffat, D Wheeler, WH Huber, D Josell Electrochemical and Solid-State Letters 4 (4), C26, 2001 | 440 | 2001 |
| Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS TP Moffat, D Wheeler, D Josell Journal of The Electrochemical Society 151 (4), C262, 2004 | 410 | 2004 |
| Superconformal electrodeposition in submicron features D Josell, D Wheeler, WH Huber, TP Moffat Physical Review Letters 87 (1), 016102, 2001 | 229 | 2001 |
| A simple equation for predicting superconformal electrodeposition in submicrometer trenches D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat Journal of the Electrochemical Society 148 (12), C767, 2001 | 194 | 2001 |
| Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers D Josell, D Wheeler, C Witt, TP Moffat Electrochemical and solid-state letters 6 (10), C143, 2003 | 193 | 2003 |
| Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing TP Moffat, D Wheeler, SK Kim, D Josell Electrochimica Acta 53 (1), 145-154, 2007 | 182 | 2007 |
| Becoming a professional engineering educator: A new role for a new era LD Fink, S Ambrose, D Wheeler Journal of Engineering Education 94 (1), 185-194, 2005 | 182 | 2005 |
| Modeling superconformal electrodeposition using the level set method D Wheeler, D Josell, TP Moffat Journal of The Electrochemical Society 150 (5), C302, 2003 | 180 | 2003 |
| Curvature enhanced adsorbate coverage model for electrodeposition TP Moffat, D Wheeler, SK Kim, D Josell Journal of the Electrochemical Society 153 (2), C127, 2006 | 178 | 2006 |
| Formation mechanisms of self-organized core/shell and core/shell/corona microstructures in liquid droplets of immiscible alloys RP Shi, CP Wang, D Wheeler, XJ Liu, Y Wang Acta materialia 61 (4), 1229-1243, 2013 | 156 | 2013 |
| Modeling extreme bottom-up filling of through silicon vias D Josell, D Wheeler, TP Moffat Journal of the Electrochemical Society 159 (10), D570, 2012 | 119 | 2012 |
| Materials knowledge systems in python—a data science framework for accelerated development of hierarchical materials DB Brough, D Wheeler, SR Kalidindi Integrating materials and manufacturing innovation 6, 36-53, 2017 | 112 | 2017 |
| Via filling by electrodeposition: Superconformal silver and copper and conformal nickel D Josell, B Baker, C Witt, D Wheeler, TP Moffat Journal of the Electrochemical Society 149 (12), C637, 2002 | 90 | 2002 |
| Accelerator aging effects during copper electrodeposition TP Moffat, B Baker, D Wheeler, D Josell Electrochemical and solid-state letters 6 (4), C59, 2003 | 89 | 2003 |
| Spatial-temporal modeling of extreme bottom-up filling of through-silicon-vias D Wheeler, TP Moffat, D Josell Journal of The Electrochemical Society 160 (12), D3260, 2013 | 80 | 2013 |
| Superconformal electrodeposition using derivitized substrates TP Moffat, D Wheeler, C Witt, D Josell Electrochemical and solid-state letters 5 (12), C110, 2002 | 80 | 2002 |
| Superfilling when adsorbed accelerators are mobile D Josell, TP Moffat, D Wheeler Journal of the Electrochemical Society 154 (4), D208, 2007 | 77 | 2007 |
| Superconformal electrodeposition of silver from a KAg (CN) 2 KCN KSeCN electrolyte BC Baker, M Freeman, B Melnick, D Wheeler, D Josell, TP Moffat Journal of the Electrochemical Society 150 (2), C61, 2002 | 77 | 2002 |
