| Physical Characterization of Current-and Temperature-Controlled Negative Differential Resistances in NbO2 S Kumar, Z Wang, N Kumari, N Davila, X Huang, JP Strachan, ... APS March Meeting Abstracts, 2017 | 199* | 2017 |
| Physical origins of current and temperature controlled negative differential resistances in NbO2 S Kumar, Z Wang, N Davila, N Kumari, K Norris, X Huang, JP Strachan, ... Nature Communications, 2017 | 199 | 2017 |
| Conduction Channel Formation and Dissolution Due to Oxygen Thermophoresis/Diffusion in Hafnium Oxide Memristors S Kumar, Z Wang, X Huang, N Kumari, N Davila, JP Strachan, D Vine, ... ACS nano 10 (12), 11205-11210, 2016 | 121 | 2016 |
| Towards the design and operation of net-zero energy data centers M Arlitt, C Bash, S Blagodurov, Y Chen, T Christian, D Gmach, C Hyser, ... Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 …, 2012 | 97 | 2012 |
| Analysis of evaporating mist flow for enhanced convective heat transfer N Kumari, V Bahadur, M Hodes, T Salamon, P Kolodner, A Lyons, ... International Journal of Heat and Mass Transfer 53 (15), 3346-3356, 2010 | 93 | 2010 |
| Oxygen migration during resistance switching and failure of hafnium oxide memristors S Kumar, Z Wang, X Huang, N Kumari, N Davila, JP Strachan, D Vine, ... Applied Physics Letters 110 (10), 2017 | 82 | 2017 |
| Characterization of the heat transfer accompanying electrowetting or gravity-induced droplet motion N Kumari, SV Garimella International Journal of Heat and Mass Transfer 54 (17), 4037-4050, 2011 | 75 | 2011 |
| Electrical actuation of electrically conducting and insulating droplets using ac and dc voltages N Kumari, V Bahadur, SV Garimella Journal of Micromechanics and Microengineering 18 (10), 105015, 2008 | 67 | 2008 |
| A holistic and optimal approach for data center cooling management R Zhou, Z Wang, CE Bash, A McReynolds, C Hoover, R Shih, N Kumari, ... Proceedings of the 2011 American Control Conference, 1346-1351, 2011 | 64 | 2011 |
| Electrical actuation of dielectric droplets N Kumari, V Bahadur, SV Garimella Journal of micromechanics and microengineering 18 (8), 085018, 2008 | 61 | 2008 |
| Electrowetting-induced dewetting transitions on superhydrophobic surfaces N Kumari, SV Garimella Langmuir 27 (17), 10342-10346, 2011 | 53 | 2011 |
| Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction SW Fong, A Sood, L Chen, N Kumari, M Asheghi, KE Goodson, ... Journal of Applied Physics 120 (1), 015103, 2016 | 44 | 2016 |
| Characterization of ultrahydrophobic hierarchical surfaces fabricated using a single-step fabrication methodology S Dash, N Kumari, SV Garimella Journal of Micromechanics and Microengineering 21 (10), 105012, 2011 | 43 | 2011 |
| Frequency-dependent transient response of an oscillating electrically actuated droplet S Dash, N Kumari, SV Garimella Journal of Micromechanics and Microengineering 22 (7), 075004, 2012 | 33 | 2012 |
| Controlled flow of a thin liquid film by electrowetting SV Garimella, HK Dhavaleswarapu, N Kumari US Patent 8,632,670, 2014 | 30 | 2014 |
| From chip to cooling tower data center modeling: Influence of air-stream containment on operating efficiency TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, B Rubenstein, S Heath, ... Journal of Electronic Packaging 134 (4), 041006, 2012 | 24 | 2012 |
| From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency EJ Walsh, J Punch, AJ Shah, CE Bash, N Kumari, T Cader | 24* | |
| From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, N Kumari, T Cader Journal of Electronic Packaging 134 (4), 041009, 2012 | 23 | 2012 |
| From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, N Kumari, T Cader Journal of Electronic Packaging 134 (4), 041009, 2012 | 23 | 2012 |
| From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, B Rubenstein, S Heath, ... Journal of Electronic Packaging 134 (4), 041006, 2012 | 23 | 2012 |
