| ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design H Chae, K Zhu, B Mutnury, D Wallace, D Winterberg, D De Araujo, ... IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023 | 3 | 2023 |
| ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning H Chae, K Zhu, B Mutnury, Z Jiang, D De Araujo, D Wallace, D Winterberg, ... 2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC), 644-650, 2024 | | 2024 |
| Method of Exploring HVM Process Corner Cases for Loss and Impedance in High Speed Designs H Chae, DZ Pan, A Klivans, B Mutnury, D Winterberg, DE Wallace, ... 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging …, 2023 | | 2023 |
