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Seunggeol Ryu
Seunggeol Ryu
Подтвержден адрес электронной почты в домене khu.ac.kr
Название
Процитировано
Процитировано
Год
Water penetration through a superhydrophobic mesh during a drop impact
S Ryu, P Sen, Y Nam, C Lee
Physical review letters 118 (1), 014501, 2017
1092017
Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials
S Ki, J Shim, S Oh, E Koh, D Seo, S Ryu, J Kim, Y Nam
International Journal of Heat and Mass Transfer 170, 121012, 2021
532021
Enhanced heat transfer using metal foam liquid supply layers for micro heat spreaders
S Ryu, J Han, J Kim, C Lee, Y Nam
International journal of heat and mass transfer 108, 2338-2345, 2017
512017
Performance analysis of gravity-driven oil–water separation using membranes with special wettability
S Oh, S Ki, S Ryu, MC Shin, J Lee, C Lee, Y Nam
Langmuir 35 (24), 7769-7782, 2019
392019
Heat transfer and capillary performance of dual-height superhydrophilic micropost wicks
S Ryu, W Lee, Y Nam
International Journal of Heat and Mass Transfer 73, 438-444, 2014
252014
A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications
S Ki, J Lee, S Ryu, S Bang, K Kim, Y Nam
International Journal of Thermal Sciences 161, 106708, 2021
242021
Superhydrophilic catenoidal aluminum micropost evaporator wicks
S Bang, S Ryu, S Ki, K Song, J Kim, J Kim, Y Nam
International Journal of Heat and Mass Transfer 158, 120011, 2020
202020
Anisotropic drop spreading on superhydrophobic grates during drop impact
J Han, S Ryu, H Kim, P Sen, D Choi, Y Nam, C Lee
Soft Matter 14 (19), 3760-3767, 2018
152018
Influence of early drop bouncing on heat transfer during drop impact
YS Ko, J Kim, S Ryu, J Han, Y Nam, C Lee
International Communications in Heat and Mass Transfer 137, 106235, 2022
52022
Rapid enhancement of thermal conductivity by incorporating oxide-free copper nanoparticle clusters for highly conductive liquid metal-based thermal interface materials
S Ki, J Shim, S Oh, S Ryu, J Kim, Y Nam
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 601-606, 2021
32021
Effective substrate thermal conductivity modeling method extracted from detailed pattern for premium SOC packages
S Hwang, B weon Lee, T Kim, Y Hyun, H Hwang, S Ryu, M Choi, Y Kim, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
32020
Enhanced capillary and heat transfer performance of asymmetric micropost wicks
S Bang, J Kim, S Ryu, S Ki, YJ Heo, C Lee, Y Nam
International Communications in Heat and Mass Transfer 146, 106935, 2023
22023
Thermal interface material, method of manufacturing the same, and semiconductor packages including the same
S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang
US Patent App. 18/437,385, 2024
2024
Thermal interface material and semiconductor packages including the same
S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang
US Patent 11,935,812, 2024
2024
Oxide-Free Copper Nanoparticle Incorporated Gallium-Based Liquid Metal Alloy for High-Performance Thermal Interface Materials
S Ki, Y Nam, J Shim, S Oh, S Ryu, J Kim
2021 Materials Research Society (MRS) Fall Meeting & Exhibit, 2021
2021
Aluminum micropost wicks with a circular hyperboloid shape for micro heat spreaders
S Bang, S Ryu, Y Nam
International Heat Transfer Conference Digital Library, 2018
2018
Compact liquid cooling system for high power IGBT modules in EV/HEV applications
S Ki, J Lee, S Ryu, Y Nam
International Heat Transfer Conference Digital Library, 2018
2018
Capillary and Thermal Performance of Advanced Multi-Height Micropost Evaporator Wicks
S Ryu, W Lee, Y Nam
International Heat Transfer Conference Digital Library, 2014
2014
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