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Michael Thomas Craton
Michael Thomas Craton
MIT Lincoln Laboratory
Подтвержден адрес электронной почты в домене ll.mit.edu
Название
Процитировано
Процитировано
Год
A chip-first approach to millimeter-wave circuit packaging
MT Craton, JD Albrecht, P Chahal, J Papapolymerou
IEEE Microwave and Wireless Components Letters 29 (2), 116-118, 2019
202019
3D printed high frequency coaxial transmission line based circuits
M Craton, JA Byford, V Gjokaj, J Papapolymerou, P Chahal
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1080-1087, 2017
182017
Realization of fully 3D printed W-band bandpass filters using aerosol jet printing technology
MT Craton, J Sorocki, I Piekarz, S Gruszczynski, K Wincza, ...
2018 48th European Microwave Conference (EuMC), 1013-1016, 2018
172018
A chip-first microwave package using multimaterial aerosol jet printing
MT Craton, X Konstantinou, JD Albrecht, P Chahal, J Papapolymerou
IEEE Transactions on Microwave Theory and Techniques 68 (8), 3418-3427, 2020
152020
In Situ Nanocomposite Fabrication for RF Electronics Applications With Additive Manufacturing
MT Craton, JD Albrecht, P Chahal, J Papapolymerou
IEEE Transactions on Microwave Theory and Techniques 68 (5), 1646-1659, 2020
92020
Fully additively manufactured broadband low loss high frequency interconnects
MT Craton, C Oakley, JD Albrecht, P Chahal, J Papapolymerou
2018 Asia-Pacific Microwave Conference (APMC), 327-329, 2018
92018
Application of aerosol jet 3-D printing with conductive and nonconductive inks for manufacturing mm-wave circuits
I Piekarz, J Sorocki, MT Craton, K Wincza, S Gruszczynski, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (3 …, 2018
82018
A bi-material fully aerosol jet printed W-band quasi-Yagi-Uda antenna
Y He, MT Craton, P Chahal, J Papapolymerou
2018 11th Global Symposium on Millimeter Waves (GSMM), 1-3, 2018
52018
Aerosol Jet 3D-Printed Compact EBG Resonators
X Konstantinou, MT Craton, JD Albrecht, J Papapolymerou
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2308-2313, 2021
32021
Additively manufactured interdigitated capacitors using barium titanate nanocomposite inks
MT Craton, Y He, A Roch, P Chahal, J Papapolymerou
2019 49th European Microwave Conference (EuMC), 488-491, 2019
32019
Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy
MT Craton, JD Albrecht, P Chahal, J Papapolymerou
IEEE Microwave and Wireless Components Letters 31 (6), 697-700, 2021
22021
A monolithic wilkinson power divider on diamond via a combination of additive manufacturing and thin-film process
X Konstantinou, CJ Herrera-Rodriguez, MT Craton, A Hardy, C Crump, ...
2020 IEEE Radio and Wireless Symposium (RWS), 201-204, 2020
22020
3d printed integrated microfluidic cooling for high power rf applications
M Craton, MIM Ghazali, B Wright, KY Park, P Chahal, J Papapolymerou
International Symposium on Microelectronics 2017 (1), 000675-000680, 2017
22017
Ultra-Wideband Transmission Lines on Complex Structures via Extendable Aerosol Jet 3D-Printing
X Konstantinou, MT Craton, JD Albrecht, J Papapolymerou
2021 IEEE International Conference on Microwaves, Antennas, Communications …, 2021
12021
Additive Manufacturing of a W-Band System-on-Package
MT Craton, X Konstantinou, JD Albrecht, P Chahal, J Papapolymerou
IEEE Transactions on Microwave Theory and Techniques 69 (9), 4191-4198, 2021
12021
A monolithic RF lowpass filter on diamond via additive manufacturing
X Konstantinou, MT Craton, CJ Herrera-Rodriguez, A Hardy, JD Albrecht, ...
2020 IEEE USNC-CNC-URSI North American Radio Science Meeting (Joint with AP …, 2020
12020
Microwave and Millimeter Wave System Integration with Additive Manufacturing
MT Craton
PQDT-UK & Ireland, 2020
12020
A polyjet 3D printed alternative for package to RFIC interconnects
M Craton, JA Byford, J Papapolymerou, P Chahal, JD Arbrecht
2017 47th European Microwave Conference (EuMC), 500-503, 2017
12017
Material mixing for additive manufacturing apparatus
MT Craton, I Papapolymerou, P Chahal, JD Albrecht
US Patent App. 17/388,418, 2022
2022
Manufactured interconnect packaging structure
I Papapolymerou, P Chahal, JD Albrecht, MT Craton, C Oakley
US Patent App. 17/056,188, 2021
2021
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Статьи 1–20