An X-band to Ka-band SPDT switch using 200 nm SiGe HBTs CHJ Poh, RL Schmid, JD Cressler, J Papapolymerou
2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2012
29 2012 A 3–20 GHz SiGe HBT ultra-wideband LNA with gain and return loss control for multiband wireless applications DC Howard, J Poh, TS Mukerjee, JD Cressler
2010 53rd IEEE International Midwest Symposium on Circuits and Systems, 445-448, 2010
25 2010 An Ultra-Thin, High-Power, and Multilayer Organic Antenna Array With T/R Functionality in the CAD Morcillo, CE Patterson, B Lacroix, C Coen, CHJ Poh, JD Cressler, ...
IEEE transactions on microwave theory and techniques 60 (12), 3856-3867, 2012
21 2012 Using saturated SiGe HBTs to realize ultra-low voltage/power X-band low noise amplifiers S Seth, CHJ Poh, T Thrivikraman, R Arora, JD Cressler
2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 103-106, 2011
17 2011 High gain, high linearity, L-band SiGe low noise amplifier with fully-integrated matching network JCH Poh, P Cheng, TK Thrivikraman, JD Cressler
2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems …, 2010
14 2010 Packaging effects of multiple X-band SiGe LNAs embedded in an organic LCP substrate CHJ Poh, CE Patterson, SK Bhattacharya, SD Philips, NE Lourenco, ...
IEEE Transactions on components, packaging and manufacturing technology 2 (8 …, 2012
13 2012 Impact of Source/Drain contact and gate finger spacing on the RF reliability of 45-nm RF nMOSFETs R Arora, S Seth, JCH Poh, JD Cressler, AK Sutton, HM Nayfeh, GL Rosa, ...
2011 International Reliability Physics Symposium, 5A. 6.1-5A. 6.6, 2011
12 2011 De-embedding transmission lines using a full-wave EM-simulated pad model CHJ Poh, DC Howard, P Cheng, JD Cressler, J Papapolymerou
2010 Asia-Pacific Microwave Conference, 1208-1211, 2010
12 2010 Extraction of a lumped element, equivalent circuit model for via interconnections in 3-D packages using a single via structure with embedded capacitors CHJ Poh, SK Bhattacharya, J Ferguson, JD Cressler, J Papapolymerou
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
12 2010 Organic wafer-scale packaging for X-band SiGe low noise amplifier CE Patterson, TK Thrivikraman, SK Bhattacharya, CHJ Poh, JD Cressler, ...
2009 European Microwave Conference (EuMC), 141-144, 2009
12 2009 A lightweight, 64-element, organic phased array with integrated transmit-receive SiGe circuitry in the X band CAD Morcillo, C Patterson, TK Thrivikraman, B Lacroix, B Wilson, ...
2011 IEEE MTT-S International Microwave Symposium, 1-4, 2011
6 2011 Low-power and low-voltage X-band silicon-germanium heterojunction bipolar transistor low-noise amplifier CHJ Poh, S Seth, RL Schmid, JD Cressler, J Papapolymerou
IET microwaves, antennas & propagation 6 (12), 1325-1331, 2012
5 2012 A systematic measurement technique to characterize bimodal oscillation for CMOS Quadrature LC-VCO SC Shin, SW Hsiao, JCH Poh, J Laskar
2010 Asia-Pacific Microwave Conference, 1051-1054, 2010
3 2010 A new and simple measurement approach for characterizing intermodulation distortion without using a spectrum analyzer A Madan, T Thrivikraman, S Seth, R Verma, J Poh, JD Cressler
2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems …, 2010
2 2010 Radio Frequency Circuit Design and Packaging for Silicon-germanium Hetrojunction Bipolar Technology CH Poh
Georgia Institute of Technology, 2009
1 2009 SiGe HBT BiCMOS RF front-ends for radar systems CH Poh
Georgia Institute of Technology, 2011
2011 An LCP package model for use in chip/package co-design of an X-band SiGe Low Noise Amplifier CHJ Poh, TK Thrivikraman, SK Bhattacharya, CE Patterson, JD Cressler, ...
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging …, 2009
2009 