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Xianbo Yang
Xianbo Yang
Signal Integrity Engineer at IBM
Подтвержден адрес электронной почты в домене ibm.com
Название
Процитировано
Процитировано
Год
CNTs and graphene-based diodes for microwave and millimeter-wave circuits on flexible substrates
A Kaur, X Yang, P Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
212016
On-wafer terahertz ribbon waveguides using polymer–ceramic nanocomposites
X Yang, PP Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2015
162015
Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates
A Kaur, X Yang, P Chahal
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2168-2174, 2014
152014
Large-area low-cost substrate compatible CNT Schottky diode for THz detection
X Yang, P Chahal
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2158-2164, 2011
152011
Reduced graphene oxide based Schottky diode on flex substrate for microwave circuit applications
A Kaur, X Yang, KY Park, P Chahal
2013 IEEE 63rd Electronic Components and Technology Conference, 1037-1042, 2013
62013
THz ribbon waveguides using polymer-ceramic nanocomposites
X Yang, P Chahal
2012 IEEE 62nd Electronic Components and Technology Conference, 225-230, 2012
62012
An quantitative model for tectonic activity analysis and earthquake maginitude predication based on thermal infrared anomaly
J Li, L Wu, Y Dong, S Liu, X Yang
2007 IEEE International Geoscience and Remote Sensing Symposium, 3039-3042, 2007
62007
Hydrophobic metal organic framework for enhancing performance of acoustic wave formaldehyde sensor based on polyethyleneimine and bacterial cellulose nanofilms
JL Wang, JH Shang, YJ Guo, YY Jiang, WK Xiong, JS Li, X Yang, H Torun, ...
Journal of Materials Science: Materials in Electronics 32 (14), 18551-18564, 2021
32021
Rx equalization for a high-speed channel based on bayesian active learning using dropout
X Yang, J Tang, HM Torun, WD Becker, JA Hejase, M Swaminathan
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020
32020
Embedded actives for terahertz circuit applications: Imaging array
X Yang, P Chahal
2012 IEEE 62nd Electronic Components and Technology Conference, 2082-2086, 2012
32012
Embedded diodes for microwave and millimeter wave circuits
X Yang, A Kaur, P Chahal
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2144-2150, 2014
22014
Integration of piezoelectric energy harvesting and antenna elements on a common substrate
JC Myers, BS Strachan, X Yang, P Chahal
2013 IEEE 63rd Electronic Components and Technology Conference, 1662-1666, 2013
22013
Implementation of semiconducting nanowires for the design of THz detectors
X Yang, A Kaur, P Chahal
2013 IEEE 63rd Electronic Components and Technology Conference, 2375-2380, 2013
22013
Planar terahertz circuits using thin dielectric waveguides
X Yang, J Hejase, P Paladhi, P Chahal
2011 International Conference on Infrared, Millimeter, and Terahertz Waves, 1-2, 2011
22011
Parallel Bayesian Active Learning using Dropout for Optimizing High-Speed Channel Equalization
X Yang, HM Torun, J Tang, PR Paladhi, Y Zhang, WD Becker, JA Hejase, ...
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021
12021
Invertible Neural Networks for High-Speed Channel Design & Parameter Distribution Estimation
N Ambasana, OW Bhatti, MA Dolatsara, M Swaminathan, X Yang, ...
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021
12021
Comparison of Invertible Architectures for High Speed Channel Design
OW Bhatti, O Akinwande, N Ambasana, X Yang, PR Paladhi, WD Becker, ...
2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021
2021
Broadside-Coupled Differential Routing In Package Via Pin-Field Design
Y Zhang, L Walls, M Bohra, J Tang, X Yang, WD Becker, DM Dreps
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021
2021
Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields
J Tang, X Yang, JA Hejase, M Bohra, Y Zhang, X Duan, D Kaller, ...
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021
2021
Terahertz micropolarizers using carbon microfibers
A Kaur, KY Park, X Yang, N Wiwatcharagoses, P Chahal
2013 IEEE 63rd Electronic Components and Technology Conference, 2102-2106, 2013
2013
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