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Co-authors
- Carmel MajidiProfessor of Mechanical Engineering, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
- Michael FordStaff Scientist, Lawrence Livermore National LaboratoryVerified email at llnl.gov
- Li Zhang(張立)IEEE Fellow; Professor, The Chinese University of Hong Kong (CUHK)Verified email at mae.cuhk.edu.hk
- Eric J. MarkvickaAssistant Professor of Mechanical & Materials Engineering, University of Nebraska-LincolnVerified email at unl.edu
- Neng XiaThe Chinese University of Hong KongVerified email at link.cuhk.edu.hk
- Dongdong JinHarbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
- Mohammad H MalakootiAssistant Professor, University of WashingtonVerified email at uw.edu
- Jiajun YanShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Krzysztof MatyjaszewskiCarnegie Mellon UniversityVerified email at andrew.cmu.edu
- Xiaonan (Sean) HuangUniversity of Michigan, Ann ArborVerified email at umich.edu
- Navid KazemArieca Inc., Carnegie Mellon University,Verified email at andrew.cmu.edu
- Jingxian WangNational University of SingaporeVerified email at cmu.edu
- Swarun KumarAssociate Professor, CMUVerified email at cmu.edu
- Peter HermanUniversity of TorontoVerified email at utoronto.ca
- Jonathan A. MalenProfessor of Mechanical Engineering, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
- Leiming HuCarnegie Mellon UniversityVerified email at andrew.cmu.edu
- Michael R. BockstallerProfessor, Department of Materials Science and Engineering, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
- Wei YuanSouth China University of TechnologyVerified email at scut.edu.cn
- Jiarui WangThe Chinese University of Hong KongVerified email at cuhk.edu.hk
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Chengfeng Pan (潘程枫)
Assistant Professor of Mechanical Engineering, Zhejiang University
Verified email at zju.edu.cn