Covalently Functionalized Leakage‐Free Healable Phase‐Change Interface Materials with Extraordinary High‐Thermal Conductivity and Low‐Thermal Resistance SA Abdul Jaleel, T Kim, S Baik Advanced Materials 35 (30), 2300956, 2023 | 40 | 2023 |
Carbon nanotube covalent bonding mediates extraordinary electron and phonon transports in soft epoxy matrix interface materials S Lee, D Suh, W Kim, C Xu, T Kim, C Song, C Yoo, Y Kim, J Kim, S Baik Carbon 157, 12-21, 2020 | 38 | 2020 |
High‐temperature skin softening materials overcoming the trade‐off between thermal conductivity and thermal contact resistance T Kim, S Kim, E Kim, T Kim, J Cho, C Song, S Baik Small 17 (38), 2102128, 2021 | 20 | 2021 |
Laser patterning of highly conductive flexible circuits SY Ji, CM Ajmal, T Kim, WS Chang, S Baik Nanotechnology 28 (16), 165301, 2017 | 15 | 2017 |
The effect of crystalline defects and geometry factors of multi-walled carbon nanotubes on electrical conductivity of silver-nitrile butadiene rubber composites D Lee, T Kim, CM Ajmal, S Baik Synthetic Metals 242, 23-28, 2018 | 6 | 2018 |
Fast mass transport-assisted convective heat transfer through a multi-walled carbon nanotube array W Jeon, T Kim, SM Kim, S Baik Nanoscale 10 (48), 23103-23112, 2018 | 6 | 2018 |
Ultralow Contact Resistance of Thermal Interface Materials Enabled by the Vitrimer Chemistry of a β-Hydroxy Phosphate Ester I Cha, T Kim, K Kim, S Baik, C Song Chemistry of Materials 35 (18), 7491-7499, 2023 | 5 | 2023 |
Intertube aggregation-dependent convective heat transfer in vertically aligned carbon nanotube channels W Jeon, J Ahn, T Kim, SM Kim, S Baik ACS Applied Materials & Interfaces 12 (45), 50355-50364, 2020 | 4 | 2020 |
Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials M Alayli, T Kim, S Cheon, S Baik Advanced Engineering Materials 26 (7), 2301823, 2024 | 1 | 2024 |