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Taehun kim
Taehun kim
Подтвержден адрес электронной почты в домене samsung.com
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Процитировано
Процитировано
Год
Carbon nanotube covalent bonding mediates extraordinary electron and phonon transports in soft epoxy matrix interface materials
S Lee, D Suh, W Kim, C Xu, T Kim, C Song, C Yoo, Y Kim, J Kim, S Baik
Carbon 157, 12-21, 2020
352020
Covalently Functionalized Leakage‐Free Healable Phase‐Change Interface Materials with Extraordinary High‐Thermal Conductivity and Low‐Thermal Resistance
SA Abdul Jaleel, T Kim, S Baik
Advanced Materials 35 (30), 2300956, 2023
192023
High‐temperature skin softening materials overcoming the trade‐off between thermal conductivity and thermal contact resistance
T Kim, S Kim, E Kim, T Kim, J Cho, C Song, S Baik
Small 17 (38), 2102128, 2021
172021
Laser patterning of highly conductive flexible circuits
SY Ji, CM Ajmal, T Kim, WS Chang, S Baik
Nanotechnology 28 (16), 165301, 2017
142017
The effect of crystalline defects and geometry factors of multi-walled carbon nanotubes on electrical conductivity of silver-nitrile butadiene rubber composites
D Lee, T Kim, CM Ajmal, S Baik
Synthetic Metals 242, 23-28, 2018
62018
Fast mass transport-assisted convective heat transfer through a multi-walled carbon nanotube array
W Jeon, T Kim, SM Kim, S Baik
Nanoscale 10 (48), 23103-23112, 2018
52018
Intertube aggregation-dependent convective heat transfer in vertically aligned carbon nanotube channels
W Jeon, J Ahn, T Kim, SM Kim, S Baik
ACS Applied Materials & Interfaces 12 (45), 50355-50364, 2020
42020
Ultralow Contact Resistance of Thermal Interface Materials Enabled by the Vitrimer Chemistry of a β-Hydroxy Phosphate Ester
I Cha, T Kim, K Kim, S Baik, C Song
Chemistry of Materials 35 (18), 7491-7499, 2023
22023
Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials
M Alayli, T Kim, S Cheon, S Baik
Advanced Engineering Materials 26 (7), 2301823, 2024
2024
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