| A review of SiC power module packaging: Layout, material system and integration C Chen, F Luo, Y Kang CPSS Transactions on Power Electronics and Applications 2 (3), 170-186, 2017 | 227 | 2017 |
| Leakage current reduction in a single-phase bidirectional AC–DC full-bridge inverter D Dong, F Luo, D Boroyevich, P Mattavelli IEEE Transactions on Power Electronics 27 (10), 4281-4291, 2012 | 163 | 2012 |
| Evaluation of the switching characteristics of a gallium-nitride transistor M Danilovic, Z Chen, R Wang, F Luo, D Boroyevich, P Mattavelli 2011 IEEE Energy Conversion Congress and Exposition, 2681-2688, 2011 | 161 | 2011 |
| Grid-interface bidirectional converter for residential DC distribution systems—Part 2: AC and DC interface design with passive components minimization D Dong, F Luo, X Zhang, D Boroyevich, P Mattavelli IEEE Transactions on Power Electronics 28 (4), 1667-1679, 2012 | 124 | 2012 |
| Adaptive multi-level active gate drivers for SiC power devices S Zhao, A Dearien, Y Wu, C Farnell, AU Rashid, F Luo, HA Mantooth IEEE Transactions on Power Electronics 35 (2), 1882-1898, 2019 | 110 | 2019 |
| Practical design considerations for a Si IGBT+ SiC MOSFET hybrid switch: Parasitic interconnect influences, cost, and current ratio optimization A Deshpande, F Luo IEEE Transactions on Power Electronics 34 (1), 724-737, 2018 | 104 | 2018 |
| Analysis of CM volt-second influence on CM inductor saturation and design for input EMI filters in three-phase DC-fed motor drive systems F Luo, S Wang, F Wang, D Boroyevich, N Gazel, Y Kang, AC Baisden IEEE Transactions on Power Electronics 25 (7), 1905-1914, 2010 | 100 | 2010 |
| A survey of active EMI filters for conducted EMI noise reduction in power electronic converters B Narayanasamy, F Luo IEEE Transactions on Electromagnetic Compatibility 61 (6), 2040-2049, 2019 | 97 | 2019 |
| Parasitic effects of grounding paths on common-mode EMI filter's performance in power electronics systems S Wang, YY Maillet, F Wang, R Lai, F Luo, D Boroyevich IEEE Transactions on Industrial Electronics 57 (9), 3050-3059, 2009 | 83 | 2009 |
| A novel solid state fault current limiter for DC power distribution network F Luo, J Chen, X Lin, Y Kang, S Duan 2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and …, 2008 | 80 | 2008 |
| Study of conducted EMI reduction for three-phase active front-end rectifier D Jiang, R Lai, F Wang, F Luo, S Wang, D Boroyevich iEEE transactions on Power Electronics 26 (12), 3823-3831, 2010 | 79 | 2010 |
| A variable step maximum power point tracking method using differential equation solution F Luo, P Xu, Y Kang, S Duan 2007 2nd IEEE Conference on Industrial Electronics and Applications, 2259-2263, 2007 | 74 | 2007 |
| Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing Z Yuan, H Peng, A Deshpande, B Narayanasamy, AI Emon, F Luo, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 395-406, 2019 | 69 | 2019 |
| A double-end sourced wire-bonded multichip SiC MOSFET power module with improved dynamic current sharing M Wang, F Luo, L Xu IEEE Journal of Emerging and Selected Topics in Power Electronics 5 (4 …, 2017 | 67 | 2017 |
| Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives A Deshpande, Y Chen, B Narayanasamy, Z Yuan, C Chen, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 407-416, 2019 | 66 | 2019 |
| Improving high-frequency performance of an input common mode EMI filter using an impedance-mismatching filter F Luo, D Dong, D Boroyevich, P Mattavelli, S Wang IEEE Transactions on Power Electronics 29 (10), 5111-5115, 2014 | 66 | 2014 |
| Design considerations for GaN HEMT multichip halfbridge module for high-frequency power converters F Luo, Z Chen, L Xue, P Mattavelli, D Boroyevich, B Hughes 2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 537-544, 2014 | 62 | 2014 |
| Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure C Chen, Z Huang, L Chen, Y Tan, Y Kang, F Luo IEEE Transactions on Power Electronics 34 (6), 5579-5593, 2018 | 60 | 2018 |
| A review of advanced thermal management solutions and the implications for integration in high-voltage packages AC Iradukunda, DR Huitink, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 256-271, 2019 | 55 | 2019 |
| Design of a silicon-WBG hybrid switch A Deshpande, F Luo 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2015 | 53 | 2015 |
Dushan BoroyevichVirginia TechVerified email at vt.edu
