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Miku J. Laakso
Miku J. Laakso
PhD student in KTH, School of Electrical Engineering and Computer Science, Micro and Nanosystem
Verified email at kth.se - Homepage
Title
Cited by
Cited by
Year
Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires
MJ Laakso, SJ Bleiker, J Liljeholm, GE Mårtensson, M Asiatici, AC Fischer, ...
Ieee Access 6, 44306-44317, 2018
232018
Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface
X Shi, Z Huang, MJ Laakso, F Niklaus, R Sliz, T Fabritius, M Somani, ...
Applied Surface Science 484, 655-662, 2019
182019
Through silicon vias with invar metal conductor for high-temperature applications
M Asiatici, MJ Laakso, AC Fischer, G Stemme, F Niklaus
Journal of microelectromechanical systems 26 (1), 158-168, 2016
142016
Three-dimensional printing of silica glass with sub-micrometer resolution
PH Huang, M Laakso, P Edinger, O Hartwig, GS Duesberg, LL Lai, ...
Nature Communications 14 (1), 3305, 2023
102023
Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses
MJO Laakso, S Pagliano, U Shah, GE Mårtensson, G Stemme, F Niklaus
Optics Express 28 (2), 1394-1407, 2020
82020
Vertical integration of microchips by magnetic assembly and edge wire bonding
F Ribet, X Wang, M Laakso, S Pagliano, F Niklaus, N Roxhed, G Stemme
Microsystems & Nanoengineering 6 (1), 12, 2020
52020
Maskless manufacturing of through glass vias (TGVS) and their test structures
MJ Laakso, J Liljeholm, AC Fischer, G Stemme, T Ebefors, F Niklaus
2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017
42017
Wide temperature range through silicon vias made of Invar and spin-on glass for interposers and MEMS
MJ Laakso, M Asiatici, AC Fischer, G Stemme, F Niklaus
2016 IEEE 29th International Conference on Micro Electro Mechanical Systems …, 2016
42016
Three-dimensional printing of silica-glass structures with submicrometric features
M Laakso, PH Huang, P Edinger, O Hartwig, GS Duesberg, ...
arXiv preprint arXiv:2005.06805, 2020
32020
Magnetic properties of the CoxZn1− xO (x= 0.20, 0.86, 0.92) films and its tunnel magnetoresistance
F Wang, W Wan, L Chen, MJO Laakso
Materials Research Express 2 (12), 126102, 2015
12015
Method and apparatus for additively forming an optical component
PH Huang, G Stemme, F Niklaus, KB Gylfason, M Laakso, P Edinger, ...
US Patent App. 17/171,587, 2022
2022
Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface (vol 484, pg 655, 2019)
X Shi, Z Huang, MJ Laakso, F Niklaus, R Sliz, T Fabritius, M Somani, ...
APPLIED SURFACE SCIENCE 504, 2020
2020
Microfabrication and Integration Using Sub-Picosecond Laser Pulses and Magnetic Assembly
M Laakso
Kungliga tekniska högskolan, 2020
2020
Corrigendum to" Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface"[Appl. Surf. Sci. 484 …
X Shi, Z Huang, M Laakso, F Niklaus, R Sliz, T Fabritius, M Somani, T Nyo, ...
Applied Surface Science 504, 2020
2020
Through-Glass Vias for MEMS Packaging
M Laakso, SJ Bleiker, J Liljeholm, G Mårtensson, M Asiatici, AC Fischer, ...
The Micronano System Workshop (MSW), 2018, Helsinki, Finland, 13-15 May, 2018
2018
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