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Ahmed Busnaina
Ahmed Busnaina
W.L. Smith Professor, Northeastern University
Подтвержден адрес электронной почты в домене northeastern.edu - Главная страница
Название
Процитировано
Процитировано
Год
Mitigation of layered to spinel conversion of a Li-rich layered metal oxide cathode material for Li-ion batteries
MN Ates, Q Jia, A Shah, A Busnaina, S Mukerjee, KM Abraham
Journal of The Electrochemical Society 161 (3), A290, 2013
2212013
The adhesion of dry particles in the nanometer to micrometer-size range
DS Rimai, DJ Quesnel, AA Busnaina
Colloids and surfaces A: Physicochemical and engineering aspects 165 (1-3), 3-10, 2000
1792000
Particle adhesion and removal in chemical mechanical polishing and post‐CMP cleaning
F Zhang, AA Busnaina, G Ahmadi
Journal of the Electrochemical Society 146 (7), 2665, 1999
1551999
Particle adhesion and removal mechanisms in post-CMP cleaning processes
AA Busnaina, H Lin, N Moumen, J Feng, J Taylor
IEEE transactions on semiconductor manufacturing 15 (4), 374-382, 2002
1472002
Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning
JG Park, SH Lee, JS Ryu, YK Hong, TG Kim, AA Busnaina
Journal of the Electrochemical society 153 (9), G811, 2006
1342006
An experimental study of megasonic cleaning of silicon wafers
AA Busnaina, II Kashkoush, GW Gale
Journal of the Electrochemical Society 142 (8), 2812, 1995
1271995
Method and apparatus to process substrates with megasonic energy
GL Montierth, HR Miranda, SL Maraviov, AA Busnaina
US Patent 7,238,085, 2007
1212007
Removal of particulate contaminants using ultrasonics and megasonics: a review
GW Gale, AA Busnaina
Particulate science and Technology 13 (3-4), 197-211, 1995
1181995
A nanoparticle convective directed assembly process for the fabrication of periodic surface enhanced Raman spectroscopy substrates
V Liberman, C Yilmaz, TM Bloomstein, S Somu, Y Echegoyen, ...
Adv. Mater 22 (38), 4298-4302, 2010
1092010
The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics
F Zhang, AA Busnaina, MA Fury, SQ Wang
Journal of Electronic Materials 29, 199-204, 2000
1062000
The role of particle adhesion and surface deformation in chemical mechanical polishing processes
F Zhang, A Busnaina
Electrochemical and Solid-State Letters 1 (4), 184, 1998
1051998
Monopole antenna arrays for optical trapping, spectroscopy, and sensing
AE Cetin, AA Yanik, C Yilmaz, S Somu, A Busnaina, H Altug
Applied Physics Letters 98 (11), 2011
1012011
Building highly organized single‐walled‐carbon‐nanotube networks using template‐guided fluidic assembly
X Xiong, L Jaberansari, MG Hahm, A Busnaina, YJ Jung
Small 3 (12), 2006-2010, 2007
1002007
A reusable high aspect ratio parylene-C shadow mask technology for diverse micropatterning applications
S Selvarasah, SH Chao, CL Chen, S Sridhar, A Busnaina, ...
Sensors and Actuators A: Physical 145, 306-315, 2008
962008
Wall deposition of aerosol particles in a turbulent channel flow
S Abuzeid, AA Busnaina, G Ahmadi
Journal of Aerosol Science 22 (1), 43-62, 1991
961991
Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time
K Bakhtari, RO Guldiken, P Makaram, AA Busnaina, JG Park
Journal of the electrochemical society 153 (9), G846, 2006
932006
Nanomanufacturing handbook
A Busnaina
CRC press, 2017
852017
Highly aligned scalable platinum-decorated single-wall carbon nanotube arrays for nanoscale electrical interconnects
YL Kim, B Li, X An, MG Hahm, L Chen, M Washington, PM Ajayan, ...
ACS nano 3 (9), 2818-2826, 2009
852009
Roles of cavitation and acoustic streaming in megasonic cleaning
GW GALE, AA Busnaina
Particulate science and technology 17 (3), 229-238, 1999
831999
The adhesion-induced deformation and the removal of submicrometer particles
S Krishnan, AA Busnaina, DS Rimai, LP Demejo
Journal of adhesion science and technology 8 (11), 1357-1370, 1994
821994
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Статьи 1–20