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Vaddina Kameswar Rao
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Congestion aware, fault tolerant, and thermally efficient inter-layer communication scheme for hybrid NoC-bus 3D architectures
AM Rahmani, K Latif, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen
Proceedings of the Fifth ACM/IEEE International Symposium on Networks-on …, 2011
762011
High-performance and fault-tolerant 3D NoC-bus hybrid architecture using ARB-NET-based adaptive monitoring platform
AM Rahmani, KR Vaddina, K Latif, P Liljeberg, J Plosila, H Tenhunen
IEEE Transactions on Computers 63 (3), 734-747, 2012
482012
Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip
AM Rahmani, KR Vaddina, K Latif, P Liljeberg, J Plosila, H Tenhunen
IET circuits, devices & systems 6 (5), 308-321, 2012
412012
Generic monitoring and management infrastructure for 3D NoC-Bus hybrid architectures
AM Rahmani, KR Vaddina, K Latif, P Liljeberg, J Plosila, H Tenhunen
2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip, 177-184, 2012
182012
ARB-NET: A novel adaptive monitoring platform for stacked mesh 3D NoC architectures
AM Rahmani, K Latif, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen
17th Asia and South Pacific Design Automation Conference, 413-418, 2012
182012
Thermal modeling and analysis of advanced 3D stacked structures
KR Vaddina, AM Rahmani, K Latif, P Liljeberg, J Plosila
Procedia Engineering 30, 248-257, 2012
152012
Enhancing performance of noc-based architectures using heuristic virtual-channel sharing approach
K Latif, AM Rahmani, KR Vaddina, T Seceleanu, P Liljeberg, H Tenhunen
2011 IEEE 35th Annual Computer Software and Applications Conference, 442-447, 2011
102011
Self-timed thermal sensing and monitoring of multicore systems
KR Vaddina, E Nigussie, P Liljeberg, J Plosila
2009 12th International Symposium on Design and Diagnostics of Electronic …, 2009
92009
Enhancing performance sustainability of fault tolerant routing algorithms in NoC-based architectures
K Latif, AM Rahmani, KR Vaddina, T Seceleanu, P Liljeberg, H Tenhunen
2011 14th Euromicro Conference on Digital System Design, 626-633, 2011
82011
Power and area optimization of 3d networks-on-chip using smart and efficient vertical channels
AM Rahmani, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen
Integrated Circuit and System Design. Power and Timing Modeling …, 2011
82011
On-line distributed thermal sensing and monitoring of multicore systems
KR Vaddina, L Guang, E Nigussie, P Liljeberg, J Plosila
2008 NORCHIP, 89-93, 2008
72008
Power and thermal analysis of stacked mesh 3D NoC using AdaptiveXYZ routing algorithm
AM Rahmani, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen
2012 15th Euromicro Conference on Digital System Design, 208-215, 2012
62012
Thermal analysis of advanced 3d stacked systems
KR Vaddina, AM Rahmani, K Latif, P Liljeberg, J Plosila
2011 IEEE Computer Society Annual Symposium on VLSI, 371-372, 2011
62011
Experimental energy profiling of energy-critical embedded applications
KR Vaddina, F Brandner, G Memmi, P Jouvelot
2017 25th International Conference on Software, Telecommunications and …, 2017
52017
Thermal modelling of 3D multicore systems in a flip-chip package
KR Vaddina, T Mitra, P Liljeberg, J Plosila
23rd IEEE International SOC Conference, 379-383, 2010
52010
ELL-i: An inexpensive platform for fixed things
P Nikander, VK Rao, P Liuha, H Tenhunen
Scalable Computing: Practice and Experience 14 (3), 155-168, 2013
42013
Transient temperature prediction for aging thermal sensors using artificial neural network
KR Vaddina, JM Cebrián, L Natvig
2016 24th Euromicro International Conference on Parallel, Distributed, and …, 2016
32016
Thermal analysis of job allocation and scheduling schemes for 3d stacked noc's
KR Vaddina, AM Rahmani, K Latif, P Liljeberg, J Plosila
2011 14th Euromicro Conference on Digital System Design, 643-648, 2011
32011
Power-efficient inter-layer communication architectures for 3d noc
AM Rahmani, K Latif, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen
2011 IEEE Computer Society Annual Symposium on VLSI, 355-356, 2011
32011
Experimental workflow for energy and temperature profiling on HPC systems
KR Vaddina, L Lefevre, AC Orgerie
2021 IEEE Symposium on Computers and Communications (ISCC), 1-7, 2021
22021
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