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C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
CHEN Xianfeng (Michael)Institute for Bioengineering, School of Engineering, The University of EdinburghVerified email at ed.ac.uk
Juan Antonio ZapienCity Uniiversity of Hong KongVerified email at cityu.edu.hk
NG Tsz-WaiCity University of Hong KongVerified email at cityu.edu.hk
zhenyu.zhangDoctor of Chongqing Communication InstituteVerified email at cqu.edu.cn
Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
Chundong WangHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Zhubing HESouthern University of Science and TechnologyVerified email at sustc.edu.cn
Yousheng ZouProfessor of Shchool of Materials Science and Engineering, Nanjing University of Science andVerified email at mail.njust.edu.cn
Shuilin WuCity University of Hong KongVerified email at my.cityu.edu.hk
Xin JiangProfessor, University of SiegenVerified email at uni-siegen.de
CHENG JunyeShenzhen MSU-BIT UniversityVerified email at smbu.edu.cn
Wenyue LiArizona State UniversityVerified email at asu.edu
Xiaoyue ZhuUniversity of Rhode IslandVerified email at uri.edu
Chaoping LiuShantou UniversityVerified email at stu.edu.cn
Jinfeng ZhangSchool of Life Sciences, Beijing Institute of TechnologyVerified email at bit.edu.cn
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
Kaili ZhangProfessor, Dept. of Mechanical Engineering, City University of Hong KongVerified email at cityu.edu.hk
Hong-En Wang(王洪恩)Yunnan Normal University(云南师范大学)Verified email at ynnu.edu.cn
Shrawan Kumar Jha, PhD, SMIEEEImperial College LondonVerified email at imperial.ac.uk