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- C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
- CHEN Xianfeng (Michael)Institute for Bioengineering, School of Engineering, The University of EdinburghVerified email at ed.ac.uk
- Juan Antonio ZapienCity Uniiversity of Hong KongVerified email at cityu.edu.hk
- Chundong WangProfessor at Huazhong University of Science and TechnologyVerified email at hust.edu.cn
- NG Tsz-WaiCity University of Hong KongVerified email at cityu.edu.hk
- zhenyu.zhangDoctor of Chongqing Communication InstituteVerified email at cqu.edu.cn
- Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
- Shuilin WuCity University of Hong KongVerified email at my.cityu.edu.hk
- Zhubing HESouthern University of Science and TechnologyVerified email at sustc.edu.cn
- Xin JiangProfessor, University of SiegenVerified email at uni-siegen.de
- CHENG JunyeShenzhen MSU-BIT UniversityVerified email at smbu.edu.cn
- Wenyue LiMoses Lake Industries Inc.Verified email at mlindustries.com
- Xiaoyue ZhuUniversity of Rhode IslandVerified email at uri.edu
- Guo HongCity University of Hong KongVerified email at cityu.edu.hk
- Jinfeng ZhangSchool of Life Sciences, Beijing Institute of TechnologyVerified email at bit.edu.cn
- Kaili ZhangProfessor, Dept. of Mechanical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Hong-En Wang(王洪恩)Yunnan Normal University(云南师范大学物理与电子信息学院)Verified email at ynnu.edu.cn
- Chaoping LiuShantou UniversityVerified email at stu.edu.cn
- Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
- Shrawan Kumar Jha, PhD, SMIEEEImperial College LondonVerified email at imperial.ac.uk