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Co-authors
- Joanna AizenbergHarvard UniversityVerified email at seas.harvard.edu
- Tak-Sing WongProfessor of Mechanical Engineering, The Pennsylvania State UniversityVerified email at psu.edu
- Katia BertoldiSEAS, Harvard UniversityVerified email at seas.harvard.edu
- Lichen FangApple Inc.Verified email at jhu.edu
- Dr. Sicong ShanSchool of Engineering and Applied Sciences (SEAS), Harvard UniversityVerified email at seas.harvard.edu
- Pai WangUniversity of Utah; Harvard UniversityVerified email at utah.edu
- Philseok KimARPA-E, Department of EnergyVerified email at hq.doe.gov
- Santiago Orrego, Ph.D.Assistant Professor, Temple UniversityVerified email at temple.edu
- Krishna MandalDepartment of Electrical Engineering, University of South Carolina, Columbia, SC 29208, USAVerified email at cec.sc.edu
- Sindy KY TangAssociate Professor, Mechanical Engineering, Stanford UniversityVerified email at stanford.edu
- Boaz PokroyTechnion Israel Institute of TechnologyVerified email at technion.ac.il
- L MahadevanHarvard, Cambridge, MITVerified email at seas.harvard.edu
- James C. WeaverWyss Institute, Harvard UniversityVerified email at wyss.harvard.edu
- Jordan R. RaneyUniversity of PennsylvaniaVerified email at seas.upenn.edu
- Jennifer A. LewisHarvard UniversityVerified email at seas.harvard.edu
- Vladimir BulovicMassachusetts Institute of TechnologyVerified email at mit.edu
- Andrej KošmrljAssociate Professor of Mechanical and Aerospace Engineering, Princeton UniversityVerified email at princeton.edu
- Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityVerified email at seas.harvard.edu
- Mikhail KatsElectrical and Computer Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
- Darren J. LipomiDepartment of NanoEngineering, UC San DiegoVerified email at ucsd.edu