| 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE International Solid-State Circuits Conference, 188-190, 2012 | 211 | 2012 |
| Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC with Non-Uniform Heat Flux YJ Kim, YK Joshi, AG Fedorov, YJ Lee, SK Lim ASME International Conference on Nanochannels, Microchannels and …, 2009 | 156* | 2009 |
| TSV Stress Aware Timing Analysis with Applications to 3D-IC Layout Optimization JS Yang, K Athikulwongse, YJ Lee, SK Lim, DZ Pan ACM Design Automation Conference, 803-806, 2010 | 140 | 2010 |
| Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux YJ Kim, YK Joshi, AG Fedorov, YJ Lee, SK Lim ASME Journal of Heat Transfer 132 (4), 2010 | 139 | 2010 |
| Chip Placement with Deep Reinforcement Learning A Mirhoseini, A Goldie, M Yazgan, J Jiang, E Songhori, S Wang, YJ Lee, ... arXiv preprint arXiv:2004.10746, 2020 | 119 | 2020 |
| A graph placement methodology for fast chip design A Mirhoseini, A Goldie, M Yazgan, JW Jiang, E Songhori, S Wang, YJ Lee, ... Nature 594 (7862), 207-212, 2021 | 108 | 2021 |
| Design and Analysis of 3D-MAPS: A Many-Core 3D Processor with Stacked Memory MB Healy, K Athikulwongse, R Goel, MM Hossain, DH Kim, YJ Lee, ... IEEE Custom Integrated Circuits Conference, 2010 | 96 | 2010 |
| Through Silicon Via Management during 3D Physical Design: When to Add and How Many? M Pathak, YJ Lee, T Moon, SK Lim IEEE International Conference on Computer-Aided Design, 387-394, 2010 | 87 | 2010 |
| Power Benefit Study for Ultra-High Density Transistor-Level Monolithic 3D ICs YJ Lee, D Limbrick, SK Lim ACM Design Automation Conference, 2013 | 77 | 2013 |
| Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE Transactions on Computers, 2013 | 75 | 2013 |
| Ultra High Density Logic Designs Using Transistor-Level Monolithic 3D Integration YJ Lee, P Morrow, SK Lim IEEE International Conference on Computer-Aided Design, 2012 | 55 | 2012 |
| Co-Design of Signal, Power, and Thermal Distribution Networks for 3D ICs YJ Lee, YJ Kim, G Huang, M Bakir, Y Joshi, A Fedorov, SK Lim Design, Automation & Test in Europe Conference & Exhibition, 610-615, 2009 | 50 | 2009 |
| Ultra High Density Logic Designs using Monolithic 3D Integration YJ Lee, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 49 | 2013 |
| Multi-functional Interconnect Co-optimization for Fast and Reliable 3D Stacked ICs YJ Lee, R Goel, SK Lim IEEE/ACM International Conference on Computer-Aided Design, 645-651, 2009 | 45 | 2009 |
| Co-Optimization of Signal, Power, and Thermal Distribution Networks for 3D ICs YJ Lee, SK Lim IEEE Symposium on Electrical Design of Advanced Packaging and Systems …, 2008 | 35 | 2008 |
| OpenMP-Based Parallel Implementation of a Continuous Speech Recognizer on a Multi-Core System K You, Y Lee, W Sung IEEE International Conference on Acoustics, Speech and Signal Processing …, 2009 | 33 | 2009 |
| Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3D ICs YJ Lee, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 30 | 2011 |
| Timing Analysis and Optimization for 3D Stacked Multi-Core Microprocessors YJ Lee, SK Lim IEEE International 3D System Integration Conference, 2010 | 28 | 2010 |
| How to Reduce Power in 3D IC Designs: A Case Study with OpenSPARC T2 Core M Jung, T Song, Y Wan, YJ Lee, D Mohapatra, H Wang, G Taylor, ... IEEE Custom Integrated Circuits Conference, 2013 | 25 | 2013 |
| Routing Optimization of Multi-modal Interconnects In 3D ICs YJ Lee, SK Lim Electronic Components and Technology Conference, 32-39, 2009 | 21 | 2009 |
Sung Kyu LimProfessor, Georgia Institute of TechnologyVerified email at ece.gatech.edu
