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M. Baris Dogruoz
M. Baris Dogruoz
Rivos Inc.
Подтвержден адрес электронной почты в домене asme.org
Название
Процитировано
Процитировано
Год
Experiments and modeling of the hydraulic resistance and heat transfer of in-line square pin fin heat sinks with top by-pass flow
MB Dogruoz, M Urdaneta, A Ortega
International Journal of Heat and Mass Transfer 48 (23-24), 5058-5071, 2005
972005
Augmenting heat transfer from fail-safe magneto-rheological fluid dampers using fins
MB Dogruoz, EL Wang, F Gordaninejad, AJ Stipanovic
Journal of Intelligent Material Systems and Structures 14 (2), 79-86, 2003
512003
Validation of an advanced fan model with multiple reference frame approach
GV Shankaran, MB Dogruoz
2010 12th IEEE intersociety conference on thermal and thermomechanical …, 2010
402010
On the conduction and convection heat transfer from lightweight advanced heat sinks
MB Dogruoz, M Arik
IEEE transactions on components and packaging technologies 33 (2), 424-431, 2010
312010
Double-angled faceplate for air flow system
MH Lam, HT Huynh, VH Chia, MB Dogruoz
US Patent App. 14/531,615, 2016
302016
Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure
L Shan, B Ma, J Li, B Dogruoz, D Agonafer
International journal of heat and mass transfer 141, 191-203, 2019
262019
Computations with the multiple reference frame technique: Flow and temperature fields downstream of an axial fan
MB Dogruoz, G Shankaran
Numerical Heat Transfer, Part A: Applications 71 (5), 488-510, 2017
232017
Molecular dynamics simulations of thin-film evaporation: The influence of interfacial thermal resistance on a graphene-coated heated silicon substrate
B Ma, K Guye, B Dogruoz, D Agonafer
Applied Thermal Engineering 195, 117142, 2021
222021
Evolution of microdroplet morphology confined on asymmetric micropillar structures
B Ma, L Shan, B Dogruoz, D Agonafer
Langmuir 35 (37), 12264-12275, 2019
222019
Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards
GV Shankaran, MB Dogruoz, D deAraujo
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 …, 2010
212010
Experiments and modeling of the heat transfer of in-line square pin fin heat sinks with top by-pass flow
MB Dogruoz, M Urdaneta, A Ortega
ASME International Mechanical Engineering Congress and Exposition 3638, 195-206, 2002
212002
Experimental investigation of evaporation from asymmetric microdroplets confined on heated micropillar structures
L Shan, J Li, B Ma, X Jiang, B Dogruoz, D Agonafer
Experimental Thermal and Fluid Science 109, 109889, 2019
202019
Experiments and modeling of the hydraulic resistance of in-line square pin fin heat sinks with top by-pass flow
MB Dogruoz, M Urdaneta, A Ortega
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
202002
A model for flow bypass and tip leakage in pin fin heat sinks
MB Dogruoz, A Ortega, RV Westphal
172006
Experimental and numerical investigation of turbulent heat transfer due to rectangular impinging jets
MB Dogruoz
The University of Arizona., 2005
162005
Numerical investigation of shape effect on microdroplet evaporation
L Shan, S Shuai, B Ma, Z Du, B Dogruoz, D Agonafer
Journal of Electronic Packaging 141 (4), 041008, 2019
152019
Heat transfer for electronic equipment
MH Lam, HT Huynh, MB Dogruoz
US Patent 9,379,039, 2016
152016
An investigation on the conduction and convection heat transfer from advanced heat sinks
MB Dogruoz, M Arik
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
152008
Effects of trace layers and joule heating on the temperature distribution of printed circuit boards: a computational study
MB Dogruoz, MK Nagulapally
142009
Reduction of Intake Resistance for Air Flow Enhancement
VH Chia, HT Huynh, MB Dogruoz
US Patent App. 14/485,943, 2016
132016
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