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- Katia BertoldiSEAS, Harvard UniversityVerified email at seas.harvard.edu
- Sung Hoon KangKAIST, Johns Hopkins University, Harvard University, MITVerified email at kaist.ac.kr
- Pai WangUniversity of Utah; Harvard UniversityVerified email at utah.edu
- James C. WeaverWyss Institute, Harvard UniversityVerified email at wyss.harvard.edu
- Jennifer A. LewisHarvard UniversityVerified email at seas.harvard.edu
- Jordan R. RaneyUniversity of PennsylvaniaVerified email at seas.upenn.edu
- Lichen FangApple Inc.Verified email at jhu.edu
- Jongmin ShimUniversity at BuffaloVerified email at buffalo.edu
- Andrej KošmrljAssociate Professor of Mechanical and Aerospace Engineering, Princeton UniversityVerified email at princeton.edu
- Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityVerified email at seas.harvard.edu
- Johannes T. B. OverveldeAssociate Professor, AMOLF & Eindhoven University of TechnologyVerified email at amolf.nl
- Joanna AizenbergHarvard UniversityVerified email at seas.harvard.edu
- Jia LiuMedtronic PlcVerified email at medtronic.com
- Cangyu Qu (瞿苍宇)Postdoc, University of Pennsylvania; PhD, Tsinghua UniversityVerified email at seas.upenn.edu
- David R. ClarkeProfessor of Materials and Applied Physics, Harvard UniversityVerified email at seas.harvard.edu
- Tianyu GuNYU ECEVerified email at nyu.edu
- Xi-Qiao Feng (冯西桥)Professor of Solid Mechanics and Biomechanics, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Li BingweiTsinghua UniversityVerified email at manchester.ac.uk
- Sahab BabaeeMassachusetts Institute of TechnologyVerified email at mit.edu
- Filippo CasadeiGaTech
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Dr. Sicong Shan
School of Engineering and Applied Sciences (SEAS), Harvard University
Verified email at seas.harvard.edu