Yogendra Joshi
Yogendra Joshi
Professor of Mechanical Engineering, Georgia Institute of Technology
Verified email at
Cited by
Cited by
Thermal challenges in next-generation electronic systems
SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ...
IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008
Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation
C Dietz, K Rykaczewski, AG Fedorov, Y Joshi
Applied physics letters 97 (3), 2010
Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices
X Wei, Y Joshi, MK Patterson
Single-phase liquid cooled microchannel heat sink for electronic packages
HY Zhang, D Pinjala, TN Wong, KC Toh, YK Joshi
Applied Thermal Engineering 25 (10), 1472-1487, 2005
Stacked microchannel heat sinks for liquid cooling of microelectronic components
X Wei, Y Joshi
J. Electron. Packag. 126 (1), 60-66, 2004
Parametric numerical study of flow and heat transfer in microchannels with wavy walls
L Gong, K Kota, W Tao, Y Joshi
Characterization of nanostructured thermal interface materials-A review
AJ McNamara, Y Joshi, ZM Zhang
TMNN-2011. Proceedings of the International Symposium on Thermal and …, 2011
Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement
S Launay, AG Fedorov, Y Joshi, A Cao, PM Ajayan
Microelectronics Journal 37 (11), 1158-1164, 2006
Energy efficient thermal management of data centers
Y Joshi, P Kumar
Springer Science & Business Media, 2012
Thermal issues in next-generation integrated circuits
SP Gurrum, SK Suman, YK Joshi, AG Fedorov
IEEE Transactions on device and materials reliability 4 (4), 709-714, 2004
Optimization study of stacked micro-channel heat sinks for micro-electronic cooling
X Wei, Y Joshi
IEEE transactions on components and packaging technologies 26 (1), 55-61, 2003
Melting in a side heated tall enclosure by a uniformly dissipating heat source
D Pal, YK Joshi
International Journal of Heat and Mass Transfer 44 (2), 375-387, 2001
Modeling of data center airflow and heat transfer: State of the art and future trends
J Rambo, Y Joshi
Distributed and Parallel Databases 21, 193-225, 2007
VPM tokens: virtual machine-aware power budgeting in datacenters
R Nathuji, K Schwan
Proceedings of the 17th international symposium on High performance …, 2008
Thermodynamic analysis of an absorption refrigeration system with ionic-liquid/refrigerant mixture as a working fluid
YJ Kim, S Kim, YK Joshi, AG Fedorov, PA Kohl
Energy 44 (1), 1005-1016, 2012
Design and performance evaluation of a compact thermosyphon
A Pal, YK Joshi, MH Beitelmal, CD Patel, TM Wenger
IEEE Transactions on Components and Packaging Technologies 25 (4), 601-607, 2002
Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux
YJ Kim, YK Joshi, AG Fedorov, YJ Lee, SK Lim
High-speed visualization of boiling from an enhanced structure
C Ramaswamy, Y Joshi, W Nakayama, WB Johnson
International journal of heat and mass transfer 45 (24), 4761-4771, 2002
Effect of tip clearance on the thermal and hydrodynamic performance of a shrouded pin fin array
KA Moores, YK Joshi
J. Heat Transfer 125 (6), 999-1006, 2003
Application of phase change materials to thermal control of electronic modules: a computational study
D Pal, YK Joshi
The system can't perform the operation now. Try again later.
Articles 1–20