DRAMsim3: A cycle-accurate, thermal-capable DRAM simulator S Li, Z Yang, D Reddy, A Srivastava, B Jacob IEEE Computer Architecture Letters 19 (2), 106-109, 2020 | 163 | 2020 |
TSV-based 3-D ICs: Design methods and tools T Lu, C Serafy, Z Yang, SK Samal, SK Lim, A Srivastava IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017 | 47 | 2017 |
Electromigration-aware placement for 3D-ICs T Lu, Z Yang, A Srivastava 2016 17th International Symposium on Quality Electronic Design (ISQED), 35-40, 2016 | 14 | 2016 |
Thermoelectric codesign of 3-D CPUs and embedded microfluidic pin-fin heatsinks C Serafy, Z Yang, A Srivastava, Y Hu, Y Joshi IEEE Design & Test 33 (2), 40-48, 2015 | 12 | 2015 |
Physical design of 3D FPGAs embedded with micro-channel-based fluidic cooling Z Yang, A Srivastava Proceedings of the 2016 ACM/SIGDA International Symposium on Field …, 2016 | 8 | 2016 |
Phase-driven learning-based dynamic reliability management for multi-core processors Z Yang, C Serafy, T Lu, A Srivastava Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017 | 7 | 2017 |
Voltage noise induced DRAM soft error reduction technique for 3D-CPUs T Lu, C Serafy, Z Yang, A Srivastava Proceedings of the 2016 International Symposium on Low Power Electronics and …, 2016 | 6 | 2016 |
Post-placement optimization for thermal-induced mechanical stress reduction T Lu, Z Yang, A Srivastava 2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 158-163, 2016 | 6 | 2016 |
Physical co-design for micro-fluidically cooled 3D ICs Z Yang, A Srivastava 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 5 | 2016 |
Co-placement for pin-fin based micro-fluidically cooled 3D ICs Z Yang, A Srivastava International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 4 | 2015 |
Value-driven synthesis for neural network ASICs Z Yang, A Srivastava Proceedings of the International Symposium on Low Power Electronics and …, 2018 | 3 | 2018 |
HMCTherm: A cycle-accurate HMC simulator integrated with detailed power and thermal simulation Z Yang, M Zuzak, A Srivastava Proceedings of the International Symposium on Memory Systems, 209-117, 2018 | 2 | 2018 |
Enhanced Phase-Driven -Learning-Based DRM for Multicore Processors Z Yang, C Serafy, T Lu, A Srivastava IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 1 | 2018 |
ECO based placement and routing framework for 3D FPGAs with micro-fluidic cooling Z Yang, C Serafy, A Srivastava 2016 IEEE 24th Annual International Symposium on Field-Programmable Custom …, 2016 | 1 | 2016 |
Thermal, Power Delivery and Reliability Management for 3D ICS Z Yang University of Maryland, College Park, 2018 | | 2018 |
Design Space Modeling and Simulation for Physically Constrained 3D CPUs C Serafy, Z Yang, A Srivastava Proceedings of the on Great Lakes Symposium on VLSI 2017, 375-380, 2017 | | 2017 |