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Alexey Ivanov
Alexey Ivanov
Failure Analysis engineer at Weilheim Manufacturing Technology Center, Huawei Technologies
Подтвержден адрес электронной почты в домене huawei.com
Название
Процитировано
Процитировано
Год
High quality 3D shapes by silicon anodization
A Ivanov, A Kovacs, U Mescheder
physica status solidi (a) 208 (6), 1383-1388, 2011
142011
Tunable optical filters with wide wavelength range based on porous multilayers
U Mescheder, I Khazi, A Kovacs, A Ivanov
Nanoscale research letters 9, 1-6, 2014
132014
Simulation of Electrochemical Etching of Silicon with COMSOL
A Ivanov
Proceedings, COMSOL Conference, 2011
112011
Dynamic Simulation of Electrochemical Etching of Silicon
A Ivanov, U Mescheder
Proceedings of the COMSOL Conference, 2012
92012
Investigation of plastic electrode tools for electrochemical machining of silicon
VV Lyubimov, VM Volgin, U Mescheder, IV Gnidina, AS Ivanov
Precision Engineering 47, 546-556, 2017
82017
Silicon electrochemical etching for 3D microforms with high quality surfaces
A Ivanov, U Mescheder
Advanced Materials Research 325, 666-671, 2011
82011
Silicon Anodization as a Structuring Technique: Literature Review, Modeling and Experiments
A Ivanov
Springer, 2017
72017
Primary current distribution model for electrochemical etching of silicon through a circular opening
A Ivanov, U Mescheder
COMSOL Conference, Grenoble, France, 14th–16th Oct, 2015
72015
Optical sensing and analysis system based on porous layers
A Kovacs, A Malisauskaite, A Ivanov, U Mescheder, R Wittig
The 17th International Conference on Miniaturized Systems for Chemistry and …, 2013
62013
Finite-elements simulation of etch front propagation in silicon electropolishing process
A Ivanov, U Mescheder, P Woias
ECS Transactions 58 (46), 15, 2014
32014
Optimisation of surface quality of 3D silicon master forms for injection molding of optical micro elements
A Ivanov, A Kovacs, U Mescheder, S Kuhn, M Kübler, A Burr
Proc. MST Kongress, 2009
32009
Formation of arbitrarily shaped 3D-forms in silicon by electrochemical wet-etching
A Ivanov, U Mescheder, M Kroner, P Woias
Tagungsband 19th MicroMechanics Europe Workshop, 28-30, 2008
32008
Application of local backside contacts for structuring Of silicon with anodization: simulation and experiments
A Ivanov, A Kovacs, U Mescheder
Procedia Engineering 168, 1180-1183, 2016
22016
Surface micromachining (sacrificial layer) and its applications in electronic devices
A Ivanov, U Mescheder
Porous Silicon: From Formation to Applications: Optoelectronics …, 2016
22016
Finite-elements simulation for true 3D structure generation of anisotropic electrochemical wet-etching processes
M Kroener, A Ivanov, F Goldschmidtböing, U Mescheder, P Woias
ECS Transactions 19 (26), 93, 2009
22009
Einfluss unterschiedlicher Passivierungsschichten auf die Bildungsrate von porösem Silizium an Strukturkanten bei der 3DFormherstellung
A Ivanov, U Mescheder, A Kovacs, R Huster
Proceedings Mikrosystemtechnik-Kongress 2007: 15.–17. Oktober 2007, Dresden …, 2007
22007
Silicon Anodization as a Structuring Technique
A Ivanov
Springer, 2018
12018
Schmalbandige photonische Kristalle für Multispektral-Analyse
A Kovacs, A Ivanov, U Mescheder
MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme, 23.–25 …, 2017
12017
Refractometer using photonic crystals for fermentation process characterization
A Kovacs, A Ivanov, U Mescheder
2015 IEEE SENSORS, 1-4, 2015
12015
Tunable narrow band porous photonic crystals for MOEMS based scanning systems
A Kovacs, A Ivanov, U Mescheder
Procedia Engineering 120, 811-815, 2015
12015
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