| Physics and materials challenges for lead-free solders KN Tu, AM Gusak, M Li Journal of applied Physics 93 (3), 1335-1353, 2003 | 470 | 2003 |
| Kinetic theory of flux-driven ripening AM Gusak, KN Tu Physical Review B 66 (11), 115403, 2002 | 239 | 2002 |
| Diffusion-controlled solid state reactions: in alloys, thin films and nanosystems AM Gusak, TV Zaporozhets, YO Lyashenko, SV Kornienko, MO Pasichnyy, ... John Wiley & Sons, 2010 | 201 | 2010 |
| Thermomigration in SnPb composite flip chip solder joints AT Huang, AM Gusak, KN Tu, YS Lai Applied Physics Letters 88 (14), 2006 | 191 | 2006 |
| Ambient dissolution-recrystallization towards large-scale preparation of V2O5 nanobelts for high-energy battery applications X Rui, Y Tang, O Malyi, Y Gusak, A., Zhang, Z Niu, HT Tan, C Persson, ... NANO ENERGY, 2016 | 147 | 2016 |
| Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper JO Suh, KN Tu, GV Lutsenko, AM Gusak Acta Materialia 56 (5), 1075-1083, 2008 | 134 | 2008 |
| In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ... Applied physics letters 85 (13), 2502-2504, 2004 | 129 | 2004 |
| Kinetic analysis of the instability of hollow nanoparticles AM Gusak, TV Zaporozhets, KN Tu, U Gösele Philosophical Magazine 85 (36), 4445-4464, 2005 | 105 | 2005 |
| Phase diagram versus diagram of solubility: What is the difference for nanosystems? AS Shirinyan, AM Gusak, M Wautelet Acta Materialia 53 (19), 5025-5032, 2005 | 102 | 2005 |
| Electromigration-induced grain rotation in anisotropic conducting beta tin AT Wu, AM Gusak, KN Tu, CR Kao Applied physics letters 86 (24), 2005 | 91 | 2005 |
| Microstructural stability of the Kirkendall plane in solid-state diffusion MJH Van Dal, AM Gusak, C Cserháti, AA Kodentsov, FJJ Van Loo Physical review letters 86 (15), 3352, 2001 | 81 | 2001 |
| Interaction between the Kirkendall effect and the inverse Kirkendall effect in nanoscale particles AM Gusak, KN Tu Acta Materialia 57 (11), 3367-3373, 2009 | 79 | 2009 |
| Phase diagrams of decomposing nanoalloys AS Shirinyan, AM Gusak Philosophical Magazine 84 (6), 579-593, 2004 | 71 | 2004 |
| Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration FY Ouyang, KN Tu, YS Lai, AM Gusak Applied Physics Letters 89 (22), 2006 | 70 | 2006 |
| Kinetics of nucleation in the concentration gradient AM Gusak, F Hodaj, AO Bogatyrev Journal of physics: Condensed matter 13 (12), 2767, 2001 | 69 | 2001 |
| Pseudopartial wetting of WC/WC grain boundaries in cemented carbides BB Straumal, I Konyashin, B Ries, AB Straumal, AA Mazilkin, ... Materials Letters 147, 105-108, 2015 | 64 | 2015 |
| A kinetic model of copper-to-copper direct bonding under thermal compression KC Shie, AM Gusak, KN Tu, C Chen Journal of Materials Research and Technology 15, 2332-2344, 2021 | 61 | 2021 |
| Suppression of intermediate phase nucleation in binary couples with metastable solubility F Hodaj, AM Gusak Acta materialia 52 (14), 4305-4315, 2004 | 60 | 2004 |
| Spatio-temporal instabilities of the Kirkendall marker planes during interdiffusion in β'-AuZn MJH Van Dal, AM Gusak, C Cserháti, AA Kodentsov, FJJ Van Loo Philosophical magazine A 82 (5), 943-954, 2002 | 58 | 2002 |
| Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints AM Gusak, KN Tu, C Chen Scripta Materialia 179, 45-48, 2020 | 56 | 2020 |
Tetiana ZaporozhetsCherkasy National UniversityПідтверджена електронна адреса в phys.cdu.edu.ua
