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Co-authors
- Eby G. FriedmanDistinguished Professor, University of RochesterVerified email at ece.rochester.edu
- Hassan MostafaEngineering at Cairo University, Zewail City of Science and Technology, University of TorontoVerified email at staff.cu.edu.eg
- Mohamed A. SwillamThe American University in CairoVerified email at aucegypt.edu
- Maged GhoneimaMechatronics Engineering Dept, Faculty of Engineering, Ain Shams UniversityVerified email at eng.asu.edu.eg
- Muhammad KhellahIntel CorpVerified email at intel.com
- Khaled Salah, Ph.D, MBA, SMIEEESiemensVerified email at siemens.com
- Gokhan MemikProfessor, Northwestern UniversityVerified email at eecs.northwestern.edu
- Amr HelmyAssistant professor, NanoTechnology and NanoElectronics engineering program, Zewail City of ScienceVerified email at zewailcity.edu.eg
- Joseph S. FriedmanThe University of Texas at DallasVerified email at utdallas.edu
- Bruce WesselsNorthwestern UniversityVerified email at northwestern.edu
- Sally Safwat AminPower Delivery Scientist at Intel CorporationVerified email at intel.com
- Nam Sung KimW.J. ‘Jerry’ Sanders III – AMD, Inc. Endowed Chair Professor and Fellow of ACM/IEEEVerified email at illinois.edu
- Hai ZhouNorthwestern UniversityVerified email at northwestern.edu
- Nikhil RangarajuNorthwestern University, Indian Institute of Technology, MadrasVerified email at u.northwestern.edu
- Debasish DasSynopsys IncVerified email at ece.northwestern.edu
- Ali DasdanZoominfo & KD (Knowledge Discovery) ConsultingVerified email at zoominfo.com
- Ramy N. TadrosQualcommVerified email at qti.qualcomm.com
- P R MukundRochester Institute of TechnologyVerified email at rit.edu
- Shekhar BhansaliFlorida International UniversityVerified email at fiu.edu
- Keith BowmanQualcomm; Intel; Georgia Institute of TechnologyVerified email at qti.qualcomm.com