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Jose A. Hejase
Jose A. Hejase
Principal Engineer, NVIDIA Corporation
Подтвержден адрес электронной почты в домене ieee.org
Название
Процитировано
Процитировано
Год
Terahertz characterization of dielectric substrates for component design and nondestructive evaluation of packages
JA Hejase, PR Paladhi, PP Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
982011
A multiple angle method for THz time-domain material characterization
JA Hejase, EJ Rothwell, P Chahal
IEEE Transactions on Terahertz Science and Technology 3 (5), 656-665, 2013
352013
Microwave artificially structured periodic media microfluidic sensor
N Wiwatcharagoses, KY Park, JA Hejase, L Williamson, P Chahal
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1889-1893, 2011
342011
Demystifying machine learning for signal and power integrity problems in packaging
M Swaminathan, HM Torun, H Yu, JA Hejase, WD Becker
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
222020
IBM POWER9 package technology and design
S Chun, WD Becker, J Casey, S Ostrander, D Dreps, JA Hejase, RM Nett, ...
IBM Journal of Research and Development 62 (4/5), 12: 1-12: 10, 2018
182018
Self-calibrating technique for terahertz time-domain material parameter extraction
JA Hejase, EJ Rothwell, P Chahal
JOSA A 28 (12), 2561-2567, 2011
182011
Bayesian active learning for uncertainty quantification of high speed channel signaling
HM Torun, JA Hejase, J Tang, WD Beckert, M Swaminathan
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018
132018
Method for performing frequency band splitting
JA Hejase, RF Ahmed, DM Dreps, JD Jordan, NH Pham, LA Walls
US Patent 9,368,852, 2016
132016
Nonlinear eddy current technique for characterizing case hardening profiles
SC Chan, R Grimberg, JA Hejase, Z Zeng, P Lekeakatakunju, L Udpa, ...
IEEE transactions on magnetics 46 (6), 1821-1824, 2010
132010
Design study of electronically steerable half-width microstrip leaky wave antennas
JA Hejase, J Myers, L Kempel, P Chahal
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1348-1353, 2011
112011
Design and test of wide-band terahertz dielectric sub-wavelength focusing probes
JA Hejase, B Schulte, P Chahal
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1035-1040, 2011
102011
Cyber warfare awareness in lebanon: exploratory research
AJ Hejase, HJ Hejase, JA Hejase
International Journal of Cyber-Security and Digital Forensics (IJCSDF) 4 (4 …, 2015
92015
Metamaterial-inspired absorbers for Terahertz packaging applications
KY Park, JA Hejase, CS Meierbachtol, N Wiwatcharagoses, P Chahal
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2107-2113, 2011
92011
A hybrid methodology for jitter and eye estimation in high-speed serial channels using polynomial chaos surrogate models
MA Dolatsara, JA Hejase, WD Becker, M Swaminathan
IEEE Access 7, 53629-53640, 2019
82019
Package and printed circuit board design of a 19.2 Gb/s data link for high-performance computing
S Chun, J Hejase, J Tang, J Audet, D Becker, D Dreps, G Wiedemeier, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1701-1707, 2017
82017
DC wander effect of DC blocking capacitors on PCIe Gen3 signal integrity
N Na, DM Dreps, JA Hejase
2013 IEEE 63rd Electronic Components and Technology Conference, 2063-2068, 2013
72013
Terahertz packaging: Study of substrates for novel component designs
JA Hejase, PR Paladhi, P Chahal
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
72010
A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications
J Tang, JA Hejase, JC Myers, SR Connor, DM Dreps, J Kuczynski
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016
62016
Terahertz time domain methods for material characterization of layered dielectric media
JA Hejase
Michigan State University, Electrical Engineering, 2012
62012
A frequency-domain high-speed bus signal integrity compliance model: Design methodology and implementation
ST Win, JA Hejase, WD Becker, GA Wiedemeier, DM Dreps
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 545-550, 2015
52015
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Статьи 1–20