Inverse metal-assisted chemical etching produces smooth high aspect ratio InP nanostructures SH Kim, PK Mohseni, Y Song, T Ishihara, X Li Nano letters 15 (1), 641-648, 2015 | 101 | 2015 |
3D hierarchical architectures based on self-rolled-up silicon nitride membranes P Froeter, X Yu, W Huang, F Du, M Li, I Chun, SH Kim, KJ Hsia, JA Rogers, ... Nanotechnology 24 (47), 475301, 2013 | 77 | 2013 |
GaAs pillar array-based light emitting diodes fabricated by metal-assisted chemical etching PK Mohseni, S Hyun Kim, X Zhao, K Balasundaram, J Dong Kim, L Pan, ... Journal of applied physics 114 (6), 2013 | 76 | 2013 |
Ultra-high aspect ratio InP junctionless FinFETs by a novel wet etching method Y Song, PK Mohseni, SH Kim, JC Shin, T Ishihara, I Adesida, X Li IEEE Electron Device Letters 37 (8), 970-973, 2016 | 44 | 2016 |
InP FinFETs with damage-free and record high-aspect-ratio (45∶ 1) fins fabricated by metal-assisted chemical etching Y Song, PK Mohseni, SH Kim, JC Shin, C Zhang, K Chabak, X Li 2015 73rd Annual Device Research Conference (DRC), 253-254, 2015 | 2 | 2015 |
Inverse metal-assisted chemical etching of indium phosphide with sub-20 nm scalability SH Kim University of Illinois at Urbana-Champaign, 2014 | | 2014 |
Observation of Plasma Propagation in an Array of Microchannels JH Cho, SR Kim, SJ Park, JG Eden APS Annual Gaseous Electronics Meeting Abstracts, DT3. 004, 2011 | | 2011 |