Подписаться
Seung Hyun Kim
Seung Hyun Kim
University of Illinois at Urbana-Champaign
Подтвержден адрес электронной почты в домене lge.com
Название
Процитировано
Процитировано
Год
Inverse metal-assisted chemical etching produces smooth high aspect ratio InP nanostructures
SH Kim, PK Mohseni, Y Song, T Ishihara, X Li
Nano letters 15 (1), 641-648, 2015
1012015
3D hierarchical architectures based on self-rolled-up silicon nitride membranes
P Froeter, X Yu, W Huang, F Du, M Li, I Chun, SH Kim, KJ Hsia, JA Rogers, ...
Nanotechnology 24 (47), 475301, 2013
772013
GaAs pillar array-based light emitting diodes fabricated by metal-assisted chemical etching
PK Mohseni, S Hyun Kim, X Zhao, K Balasundaram, J Dong Kim, L Pan, ...
Journal of applied physics 114 (6), 2013
762013
Ultra-high aspect ratio InP junctionless FinFETs by a novel wet etching method
Y Song, PK Mohseni, SH Kim, JC Shin, T Ishihara, I Adesida, X Li
IEEE Electron Device Letters 37 (8), 970-973, 2016
442016
InP FinFETs with damage-free and record high-aspect-ratio (45∶ 1) fins fabricated by metal-assisted chemical etching
Y Song, PK Mohseni, SH Kim, JC Shin, C Zhang, K Chabak, X Li
2015 73rd Annual Device Research Conference (DRC), 253-254, 2015
22015
Inverse metal-assisted chemical etching of indium phosphide with sub-20 nm scalability
SH Kim
University of Illinois at Urbana-Champaign, 2014
2014
Observation of Plasma Propagation in an Array of Microchannels
JH Cho, SR Kim, SJ Park, JG Eden
APS Annual Gaseous Electronics Meeting Abstracts, DT3. 004, 2011
2011
В данный момент система не может выполнить эту операцию. Повторите попытку позднее.
Статьи 1–7