| Low temperature direct wafer to wafer bonding for 3D integration G Gaudin, G Riou, M Sadaka, K Winstel, E Kinser 3D Systems Integration Conference (3DIC), IEEE, 16-18, 2010 | 229 | 2010 |
| Three dimensional integrated circuit integration using dielectric bonding first and through via formation last MG Farooq, R Hannon, SS Iyer, ER Kinser US Patent 9,406,561, 2016 | 199 | 2016 |
| Three dimensional integrated circuit integration using dielectric bonding first and through via formation last MG Farooq, R Hannon, SS Iyer, ER Kinser US Patent 9,406,561, 2016 | 199 | 2016 |
| Three dimensional integrated circuit integration using dielectric bonding first and through via formation last MG Farooq, R Hannon, SS Iyer, ER Kinser US Patent 9,406,561, 2016 | 199 | 2016 |
| Three dimensional integrated circuit integration using dielectric bonding first and through via formation last MG Farooq, R Hannon, SS Iyer, ER Kinser US Patent 9,406,561, 2016 | 199 | 2016 |
| Engineering Cellular Response Using Nanopatterned Bulk Metallic Glass J Padmanabhan, ER Kinser, MA Stalter, C Duncan-Lewis, JL Balestrini, ... ACS nano 8 (5), 4366-4375, 2014 | 110 | 2014 |
| Guided Evolution of Bulk Metallic Glass Nanostructures: A Platform for Designing 3D Electrocatalytic Surfaces G Doubek, RC Sekol, J Li, WH Ryu, FS Gittleson, S Nejati, E Moy, C Reid, ... Advanced Materials 28 (10), 1940-1949, 2016 | 82 | 2016 |
| Guided Evolution of Bulk Metallic Glass Nanostructures: A Platform for Designing 3D Electrocatalytic Surfaces G Doubek, RC Sekol, J Li, WH Ryu, FS Gittleson, S Nejati, E Moy, C Reid, ... Advanced Materials 28 (10), 1940-1949, 2016 | 82 | 2016 |
| Regulation of Mesenchymal Stem Cell Differentiation by Nanopatterning of Bulk Metallic Glass AM Loye, ER Kinser, S Bensouda, M Shayan, R Davis, R Wang, Z Chen, ... Scientific reports 8 (1), 8758, 2018 | 52 | 2018 |
| Modeling the interrelating effects of plastic deformation and stress on magnetic properties of materials CCH Lo, E Kinser, DC Jiles Journal of applied physics 93 (10), 6626-6628, 2003 | 50 | 2003 |
| Atomic imprinting into metallic glasses R Li, Z Chen, A Datye, GH Simon, J Ketkaew, E Kinser, Z Liu, C Zhou, ... Communications Physics 1 (1), 75, 2018 | 43 | 2018 |
| Three dimensional integration with through silicon vias having multiple diameters MG Farooq, R Kei, ER Kinser, AD Lisi, R Wise, H Yusuff US Patent 8,399,180, 2013 | 41 | 2013 |
| Fluorine depleted adhesion layer for metal interconnect structure MG Farooq, ER Kinser US Patent 8,563,423, 2013 | 40 | 2013 |
| Untitled US Patent 8,563,423, 0 | 40* | |
| Three dimensional integration and methods of through silicon via creation MG Farooq, ER Kinser, R Wise, H Yusuff US Patent 8,415,238, 2013 | 37 | 2013 |
| Regulation of cell-cell fusion by nanotopography J Padmanabhan, MJ Augelli, B Cheung, ER Kinser, B Cleary, P Kumar, ... Scientific reports 6, 33277, 2016 | 35 | 2016 |
| Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding RR Yu, F Liu, RJ Polastre, KN Chen, XH Liu, L Shi, ED Perfecto, ... VLSI Technology, 2009 Symposium on, 170-171, 2009 | 32 | 2009 |
| Nanopatterned Bulk Metallic Glass Biosensors ER Kinser, J Padmanabhan, R Yu, SL Corona, J Li, S Vaddiraju, ... ACS sensors 2 (12), 1779-1787, 2017 | 31 | 2017 |
| High quality factor metallic glass cantilevers with tunable mechanical properties M Kanik, P Bordeenithikasem, G Kumar, E Kinser, J Schroers Applied Physics Letters 105 (13), 131911, 2014 | 30 | 2014 |
| Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues F Chen, S Mittl, M Shinosky, A Swift, R Kontra, B Anderson, J Aitken, ... Reliability Physics Symposium (IRPS), 2012 IEEE International, 6A. 4.1-6A. 4.9, 2012 | 28 | 2012 |
