Amanpreet Kaur
Amanpreet Kaur
Oakland University
Подтвержден адрес электронной почты в домене oakland.edu
Название
Процитировано
Процитировано
Год
Affordable 3D printed microwave antennas
MIMG Ghazali, E Gutierrez, JC Myers, A Kaur, B Wright, P Chahal
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, 240-246, 2015
462015
3-D Printed Air Substrates for the Design and Fabrication of RF Components
PC Mohd Ifwat Mohd Ghazali,Saranraj Karuppuswami,Amanpreet Kaur
IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-8, 2017
39*2017
Affordable terahertz components using 3D printing
A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, 2071 …, 2015
252015
A Hybrid Magnetoelastic Wireless Sensor for Detection of Food Adulteration
PC Saranraj Karuppuswami , Amanpreet Kaur , Harikrishnan Arangali
IEEE Sensors Journal, 2017
22*2017
CNTs and Graphene-Based Diodes for Microwave and Millimeter-Wave Circuits on Flexible Substrates
A Kaur, X Yang, P Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016
202016
Aerosol-Jet Printed Quasi-Optical Terahertz Filters
PC Christopher Oakley, Amanpreet Kaur, Jennifer A Byford
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th 2017 …, 2017
17*2017
3D Printed Out-of-Plane Antennas for Use on High Density Boards
PC Mohd Ifwat Mohd Ghazali, Jennifer A Byford, Saranraj Karuppuswami ...
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 1835 …, 2017
16*2017
RFID Compatible Sensor Tags for Remote Liquid Sample Interrogation
PC Saranraj Karuppuswami, Amanpreet Kaur, Mohd Ifwat Mohd Ghazali
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, 2016
16*2016
Embedded Actives Using Additive Manufacturing For High Density RF Circuits and Systems
PC Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Saikat Mondal, Amanpreet Kaur
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
152019
Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates
A Kaur, X Yang, P Chahal
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2168 …, 2014
152014
Selective Fabrication of SiC/Si Diodes by Excimer Laser under Ambient Conditions
A Kaur, P Chahal, T Hogan
Electronic Device Letters 37 (2), 142-145, 2016
142016
A Nonlinear Transmission Line Based Harmonic RF Tag
PC Saikat Mondal, Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Amanpreet Kaur
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 2237 …, 2017
12*2017
Capillary Condensation Based Wireless Volatile Molecular Sensor
PC Saranraj Karuppuswami, Nophadon Wiwatcharagoses, Amanpreet Kaur
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 1455 …, 2017
11*2017
3D Printed Metalized Plastic Waveguides for Microwave Components
PC Mohd Ifwat Mohd Ghazali, Kyoung Youl Park, Vincens Gjokaj, Amanpreet Kaur
International Symposium on Microelectronics 2017 (1), 000078-0000, 2017
92017
Deep Subwavelength Power Concentration-Based Hyperbolic Metamaterials
A Kaur, S Banerjee, W Zhao, J Venkataraman, Z Lu
International Journal of Optics 2012, 2012
92012
An RF backscatterer system for real-time multi-sensing applications
PC Deepak Kumar, Saikat Mondal, Amanpreet Kaur, Yiming Deng
Sensors and Actuators A: Physical, 111685, 2019
6*2019
Low-loss RF filter through a combination of additive manufacturing and thin-film process
PC Leonardo Hernandez, Yuxiao He, Amanpreet Kaur, John Papapolymerou
2017 IEEE Radio and Wireless Symposium (RWS), 114-116, 2017
62017
Reduced graphene oxide based Schottky diode on flex substrate for microwave circuit applications
A Kaur, X Yang, KY Park, Park, P Chahal
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 1037 …, 2013
62013
3D Printed high functional density packaging compatible out-of-plane antennas
PC Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Amanpreet Kaur
Additive Manufacturing, 2019
52019
RF Characterization of NiO and TiO2 Based Metal-Insulator-Metal (MIM) Diodes on Flexible Substrates
A Kaur, P Chahal
IEEE Access, 2018
52018
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Статьи 1–20