Подписаться
Seokkan Ki
Seokkan Ki
Mobile R&D Center at Samsung Electronics
Подтвержден адрес электронной почты в домене samsung.com - Главная страница
Название
Процитировано
Процитировано
Год
Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials
S Ki, J Shim, S Oh, E Koh, D Seo, S Ryu, J Kim, Y Nam
International Journal of Heat and Mass Transfer 170, 121012, 2021
542021
Performance analysis of gravity-driven oil–water separation using membranes with special wettability
S Oh, S Ki, S Ryu, MC Shin, J Lee, C Lee, Y Nam
Langmuir 35 (24), 7769-7782, 2019
392019
A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications
S Ki, J Lee, S Ryu, S Bang, K Kim, Y Nam
International Journal of Thermal Sciences 161, 106708, 2021
242021
An energy-efficient battery thermal management system incorporating a porous metal-based multiscale flow manifold
S Ki, J Lee, S Kim, J Seong, J Shim, S Oh, S Cho, S Bang, D Seo, J Kim, ...
Energy Conversion and Management 269, 116147, 2022
232022
Superhydrophilic catenoidal aluminum micropost evaporator wicks
S Bang, S Ryu, S Ki, K Song, J Kim, J Kim, Y Nam
International Journal of Heat and Mass Transfer 158, 120011, 2020
212020
Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)
J Lee, S Ki, D Seo, J Kim, Y Nam
Applied Thermal Engineering 173, 115230, 2020
202020
Optimizing Energy-Efficient jet impingement cooling using an artificial neural network (ANN) surrogate model for high heat flux Semiconductors
S Kim, S Ki, S Bang, S Han, J Seo, C Ahn, S Maeng, BJ Lee, Y Nam
Applied Thermal Engineering 239, 122101, 2024
42024
Compact liquid cooling module incorporating metal foam and fin hybrid structures for high power IGBTs
J Lee, S Ki, Y Nam
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
42019
Rapid enhancement of thermal conductivity by incorporating oxide-free copper nanoparticle clusters for highly conductive liquid metal-based thermal interface materials
S Ki, J Shim, S Oh, S Ryu, J Kim, Y Nam
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 601-606, 2021
32021
Enhanced capillary and heat transfer performance of asymmetric micropost wicks
S Bang, J Kim, S Ryu, S Ki, YJ Heo, C Lee, Y Nam
International Communications in Heat and Mass Transfer 146, 106935, 2023
22023
Sustainable Thermal Regulation of Electronics via Mitigated Supercooling of Porous Gallium‐Based Phase Change Materials
S Ki, S Shin, S Cho, S Bang, D Choi, Y Nam
Advanced Science, 2310185, 2024
12024
Thermal interface material, method of manufacturing the same, and semiconductor packages including the same
S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang
US Patent App. 18/437,385, 2024
2024
Semiconductor package with a heat dissipation member
J Lee, Y Nam, S Ki, J Kim, T Kim
US Patent App. 18/512,640, 2024
2024
Intermittent spray cooling on rationally-designed hierarchical surfaces for enhanced evaporative heat transfer performance
J Shim, S Ki, D Seo, B Moon, S Bang, Y Nam
International Communications in Heat and Mass Transfer 153, 107354, 2024
2024
Thermal interface material and semiconductor packages including the same
S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang
US Patent 11,935,812, 2024
2024
Oxide-Free Copper Nanoparticle Incorporated Gallium-Based Liquid Metal Alloy for High-Performance Thermal Interface Materials
S Ki, Y Nam, J Shim, S Oh, S Ryu, J Kim
2021 Materials Research Society (MRS) Fall Meeting & Exhibit, 2021
2021
Compact liquid cooling system for high power IGBT modules in EV/HEV applications
S Ki, J Lee, S Ryu, Y Nam
International Heat Transfer Conference Digital Library, 2018
2018
Artificial Neural Network (Ann)-Based Multi-Objective Optimization of the Vapor Chamber with Liquid Supply Layer for High Heat Flux Applications
S Bang, S Kim, S Ki, J Seo, J Kim, BJ Lee, Y Nam
Available at SSRN 4668100, 0
IEEE Electronic Packaging Society Major Awards
OY Engineer, EPSPDS Fellowship
В данный момент система не может выполнить эту операцию. Повторите попытку позднее.
Статьи 1–19