Growth, surface morphology, and electrical resistivity of fully strained substoichiometric epitaxial CS Shin, S Rudenja, D Gall, N Hellgren, TY Lee, I Petrov, JE Greene
Journal of Applied Physics 95 (1), 356-362, 2004
146 2004 Growth, surface morphology, and electrical resistivity of fully strained substoichiometric epitaxial TiNx (0.67x<1.0) layers on MgO(001) J Greene
146 2004 Duplex TiN coatings deposited by arc plating for increased corrosion resistance of stainless steel substrates S Rudenja, C Leygraf, J Pan, P Kulu, E Talimets, V Mikli
Surface and Coatings Technology 114 (2-3), 129-136, 1999
116 1999 Passivation and anodic oxidation of duplex TiN coating on stainless steel S Rudenja, J Pan, IO Wallinder, C Leygraf, P Kulu
Journal of The Electrochemical Society 146 (11), 4082, 1999
67 1999 Surface interpenetrating networks of poly (ethylene terephthalate) and polyamides for effective biocidal properties S Liu, N Zhao, S Rudenja
Macromolecular Chemistry and Physics 211 (3), 286-296, 2010
53 2010 Electrodeposition of copper on Ru (0 0 0 1) in sulfuric acid solution: Growth kinetics and nucleation behavior J Kelber, S Rudenja, C Bjelkevig
Electrochimica acta 51 (15), 3086-3090, 2006
40 2006 Low-temperature deposition of stoichiometric HfO2 on silicon: Analysis and quantification of the HfO2/Si interface from electrical and XPS measurements S Rudenja, A Minko, DA Buchanan
Applied surface science 257 (1), 17-21, 2010
36 2010 The effects of an iodine surface layer on Ru reactivity in air and during Cu electrodeposition J Liu, J Lei, N Magtoto, S Rudenja, M Garza, JA Kelber
Journal of the Electrochemical Society 152 (2), G115, 2004
34 2004 Surface interpenetrating networks of polyacrylamide in poly (ethylene terephthalate) as a means of surface modification S Rudenja, N Zhao, S Liu
European polymer journal 46 (10), 2078-2084, 2010
24 2010 Cu electrodeposition on Ru (0001): Perchlorate dissociation and its effects on Cu deposition J Lei, S Rudenja, N Magtoto, JA Kelber
Thin Solid Films 497 (1-2), 121-129, 2006
23 2006 Electrodeposition of adherent copper film on unmodified tungsten C Wang, J Lei, C Bjelkevig, S Rudenja, N Magtoto, J Kelber
Thin solid films 445 (1), 72-79, 2003
19 2003 Seedless electrodeposition of Cu on unmodified tungsten C Wang, J Lei, S Rudenja, N Magtoto, J Kelber
Electrochemical and solid-state letters 5 (9), C82, 2002
13 2002 Corrosion performance of duplex TiN coatings deposited by arc plating S Rudenja, P Kulu, E Tallimets, V Mikli, CA Straede
Surface and Coatings Technology 100, 247-250, 1998
13 1998 Plasmonic device, system, and methods S Rudenja, MS Freund
US Patent 8,314,445, 2012
9 2012 Enhanced passivity of austenitic AISI 304 stainless steel by low-temperature ion nitriding S Rudenja, J Pan, IO Wallinder, C Leygraf, P Kulu, V Mikli
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 19 (4 …, 2001
9 2001 Conductor structures including penetrable materials JA Kelber, J Lei, NP Magtoto, S Rudenja
US Patent 7,534,967, 2009
6 2009 Corrosion Performance of Titanium-Based Composite Coatings Deposited by Physical Vapour Deposition S Rudenja, P KULU, E TALIMETS, V Mikli, O Forsen
Proc. Estonian Acad. Sci. Engin 2 (1), 1996
4 1996 Photoexcitation of Intrinsic Plasmon in Emeraldine Electroactive Device S Rudenja, MS Freund
Journal of The Electrochemical Society 157 (8), H787, 2010
2 2010 Conducting interpenetrating polymer networks, related methods, compositions and systems S Rudenja
US Patent App. 14/098,520, 2015
1 2015 Corrosion performance and structure of the titanium-based coatings deposited onto stainless steel substrate with arc plating S Rudenja, P Kulu, E Talimets, V Mikli, F Erikhov, C Straede
Society of Vacuum Coaters 40 th Annual Technical Conference, 58-63, 1997
1 1997 