| Temperature cycling reliability of high-temperature lead-free die-attach technologies PO Quintero, FP McCluskey IEEE Transactions on Device and Materials Reliability 11 (4), 531-539, 2011 | 77 | 2011 |
| Experimental evaluation of metallic phase change materials for thermal transient mitigation D Gonzalez-Nino, LM Boteler, D Ibitayo, NR Jankowski, D Urciuoli, ... International Journal of Heat and Mass Transfer 116, 512-519, 2018 | 67 | 2018 |
| Thermal stability characterization of the Au–Sn bonding for high-temperature applications RI Rodriguez, D Ibitayo, PO Quintero IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (4 …, 2013 | 34 | 2013 |
| Silver-indium transient liquid phase sintering for high temperature die attachment PO Quintero, FP McCluskey Journal of microelectronics and electronic packaging 6 (1), 66-74, 2009 | 26 | 2009 |
| Reliability assessment of high temperature lead-free device attach technologies P Quintero, T Oberc, P McCluskey 2008 58th Electronic Components and Technology Conference, 2131-2138, 2008 | 25 | 2008 |
| Development of a shifting melting point silver-indium paste via Transient Liquid Phase Sintering for high temperature environments PO Quintero University of Maryland, College Park, 2008 | 18 | 2008 |
| Development of a shifting melting point silver-indium paste via Transient Liquid Phase Sintering for high temperature environments PO Quintero University of Maryland, College Park, 2008 | 18 | 2008 |
| Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications P Quintero, P McCluskey, B Koene Microelectronics Reliability 54 (1), 220-225, 2014 | 12 | 2014 |
| Impacting students from economically disadvantaged groups in an engineering career pathway M Jimenez, L Guillemard, S Bartolomei-Suarez, O Suarez, ... 2020 ASEE Virtual Annual Conference, 2020 | 10 | 2020 |
| Kinetics of dissolution and isothermal solidification for gold-enriched solid–liquid interdiffusion (SLID) bonding RI Rodriguez, D Ibitayo, PO Quintero Journal of electronic materials 42, 2677-2685, 2013 | 10 | 2013 |
| Voiding effects on the thermal response of metallic phase change materials under pulsed power loading D Gonzalez-Nino, LM Boteler, NR Jankowski, D Ibitayo, PO Quintero International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 8 | 2017 |
| Numerical evaluation of multiple phase change materials for pulsed electronics applications D Gonzalez-Nino, LM Boteler, D Ibitayo, NR Jankowski, PO Quintero Heat Transfer Summer Conference 50336, V002T11A004, 2016 | 8 | 2016 |
| High Temperature Solder Materials PF McCluskey, P Quintero US Patent App. 12/500,948, 2010 | 7 | 2010 |
| High Temperature Solder Materials PF McCluskey, P Quintero US Patent App. 12/500,948, 2010 | 7 | 2010 |
| High Temperature Solder Materials PF McCluskey, P Quintero US Patent App. 12/500,948, 2010 | 7 | 2010 |
| Tin nanoparticle-based solder paste for low temperature processing AJ Diaz, D Ma, A Zinn, PO Quintero Journal of microelectronics and electronic packaging 10 (4), 129-137, 2013 | 6 | 2013 |
| High temperature lead-free attach reliability P Quintero, P McCluskey Proc of ASME-IPACK, 2007 | 6 | 2007 |
| WIP: Building Career Goals and Boosting Self-efficacy in Engineering Students M Jimenez, L Guillemard, S Bartolomei, OM Suarez, C Lopez, P Quintero, ... Proceedings of 2021 ASEE Annual Conference and Exposition, Long Beach, CA …, 2021 | 5 | 2021 |
| Microstructural stability of Au-Sn SLID joints for harsh environments PR Soto, PO Quintero, M Mulero, D Ibitayo International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 5 | 2015 |
| High temperature lead-free attach reliability P McCluskey, PO Quintero International Electronic Packaging Technical Conference and Exhibition 42789 …, 2007 | 5 | 2007 |
