Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system A Das, N Krishna, M Schweitzer, N Patadia, W Yang, U Kelkar, V Parkhe, ... US Patent 6,190,037, 2001 | 335 | 2001 |
Analytical solution for constriction resistance with interstitial fluid in the gap AK Das, SS Sadhal Heat and mass transfer 34, 111-119, 1998 | 38 | 1998 |
Aluminum deposition shield A Subramani, AK Das, LE DeLaurentis, M Rosenstein US Patent 6,589,407, 2003 | 27 | 2003 |
Dropwise condensation of steam on horizontal corrugated tubes using an organic self-assembled monolayer coating A Das, HP Kilty, PJ Marto, A Kumar, GB Andeen Journal of Enhanced Heat Transfer 7 (2), 2000 | 27 | 2000 |
The effect of interstitial fluid on thermal constriction resistance AK Das, SS Sadhal | 25 | 1992 |
Thermal constriction resistance between two solids for random distribution of contacts AK Das, SS Sadhal Heat and mass transfer 35 (2), 101-111, 1999 | 24 | 1999 |
Identifying and managing dilemmas for sustainable development of rural India A Yadav, AK Das, RB Roy, A Chatterjee, JK Allen, F Mistree International design engineering technical conferences and computers and …, 2017 | 18 | 2017 |
The effect of fin height during steam condensation on a horizontal stainless steel integral-fin tube A Das, GA Incheck, PJ Marto Journal of Enhanced Heat Transfer 6 (2-4), 1999 | 14 | 1999 |
Integrating quality of life in sociotechnical design: a review of microgrid design tools and social indicators H Suk, J Hall International Design Engineering Technical Conferences and Computers and …, 2019 | 11 | 2019 |
A note on the evaluation of thermal constriction resistance for finite thickness gaps AK Das, SS Sadhal | 11 | 1997 |
A computational framework to support social entrepreneurs in creating value for rural communities in India A Yadav, AK Das, JK Allen, F Mistree International Design Engineering Technical Conferences and Computers and …, 2019 | 10 | 2019 |
Microgrid Power Management With Integrated Quality of Life Considerations H Suk, A Sharma, A Balu Nellippallil, AK Das, J Hall International Design Engineering Technical Conferences and Computers and …, 2020 | 6 | 2020 |
The effect of clustering in thermal contact resistance AK Das, SS Sadhal International Heat Transfer Conference Digital Library, 1990 | 6 | 1990 |
A Method for Social Entrepreneurs to Develop Value Propositions for Sustainable Development. VVR Kamala, AK Das, A Sharma, JK Allen, F Mistree International Journal of Sustainable Development & Planning 17 (8), 2022 | 5 | 2022 |
A Computational Framework for Social Entrepreneurs to Determine Policies for Sustainable Development V Karkaria, AK Das, A Yadav, A Sharma, JK Allen, F Mistree International Design Engineering Technical Conferences and Computers and …, 2021 | 4 | 2021 |
A Framework for Improving Rural Microgrid Sustainability Through Integrated Socio-technical Considerations H Suk, A Sharma, AB Nellippallil, A Das, J Hall Design for Tomorrow—Volume 3: Proceedings of ICoRD 2021, 285-295, 2021 | 4 | 2021 |
Identifying Sustainable Solutions for Sanitation, Energy, and Water Needs in Off-Grid Indian Villages AV Nair, A Balu Nellippallil, AK Das, J Hall, JK Allen, F Mistree International Design Engineering Technical Conferences and Computers and …, 2020 | 4 | 2020 |
Connectors for an eletrostatic chuck WL Cheng, DS Grimard, S Thach, CH Tsai, AK Das, VD Parkhe US Patent App. 09/370,651, 2002 | 4 | 2002 |
High pressure/high temperature process chamber AK Das, J Stevens, E Tzou, M Tsai US Patent 5,990,453, 1999 | 4 | 1999 |
Thermal constriction resistance: the effect of interstitial fluid AK Das, SS Sadhal ASME HTD 173, 35-39, 1991 | 4 | 1991 |