| Cryogenic etching of porous low-k dielectrics in CF3Br and CF4 plasmas A Rezvanov, AV Miakonkikh, AS Vishnevskiy, KV Rudenko, MR Baklanov Journal of Vacuum Science & Technology B 35 (2), 2017 | 30 | 2017 |
| Evaluation of mechanical properties of porous OSG films by PFQNM AFM and benchmarking with traditional instrumentation IS Ovchinnikov, AS Vishnevskiy, DS Seregin, AA Rezvanov, D Schneider, ... Langmuir 36 (32), 9377-9387, 2020 | 28 | 2020 |
| Effect of terminal methyl group concentration on critical properties and plasma resistance of organosilicate low-k dielectrics AA Rezvanov, AV Miakonkikh, DS Seregin, AS Vishnevskiy, KA Vorotilov, ... Journal of Vacuum Science & Technology A 38 (3), 2020 | 16 | 2020 |
| Benzene bridged hybrid organosilicate films with improved stiffness and small pore size AA Rezvanov, AS Vishnevskiy, DS Seregin, D Schneider, AA Lomov, ... Materials Chemistry and Physics 290, 126571, 2022 | 11 | 2022 |
| Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface A Rezvanov, ES Gornev, JF de Marneffe, S Armini Applied Surface Science 476, 317-324, 2019 | 11 | 2019 |
| Low-k protection from F radicals and VUV photons using a multilayer pore grafting approach A Zotovich, A Rezvanov, R Chanson, L Zhang, N Hacker, K Kurchikov, ... Journal of Physics D: Applied Physics 51 (32), 325202, 2018 | 9 | 2018 |
| Pore surface grafting of porous low-k dielectrics by selective polymers JFGNGM Askar Rezvanov, Liping Zhang, Mitsuhiro Watanabe, Mikhail B. Krishtab ... Journal of Vacuum Science & Technology B http://avs.scitation.org/doi/full …, 2017 | 9 | 2017 |
| Modification of Porous Ultralow-k Film by Vacuum Ultraviolet Emission AI Zotovich, SM Zyryanov, DV Lopaev, AA Rezvanov, AG Attallah, ... ACS Applied Electronic Materials 4 (6), 2760-2776, 2022 | 4 | 2022 |
| Атомно-слоевое осаждение тонких пленок оксида гафния с использованием установки «Изофаз Т. 200-01» СС ЗЮЗИН, ЯГ ЗАССЕЕВ, АА РЕЗВАНОВ, ВВ ПАНИН, ВА ГВОЗДЕВ, ... Наноиндустрия 15 (S8-2), 548-552, 2022 | 4 | 2022 |
| Use of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics JF Marneffe, T Yamaguchi, M Fujikawa, A Rezvanov, R Chanson, J Zhang, ... ACS Applied Electronic Materials 1 (12), 2602-2611, 2019 | 4 | 2019 |
| Изобары адсорбции фторуглеродных соединений, выбранных для криогенного плазменного травления low-k диэлектриков АА Резванов, ОП Гущин, ЕС Горнев, ГЯ Красников, КП Могильников, ... Электронная техника, серия: Микроэлектроника 3 (1(157)), 49, 2015 | 4 | 2015 |
| Cellular-automata model of oxygen plasma impact on porous low-K dielectric A Rezvanov, IV Matyushkin, OP Gutshin, ES Gornev International Conference on Micro-and Nano-Electronics 2016 10224, 483-492, 2016 | 3 | 2016 |
| Клеточно-автоматная модель воздействия O2 плазмы на интегральные свойства SiOCH low-К диэлектрика А Резванов, ИВ Матюшкин, ОП Гущин Электронная техника. Серия 3: Микроэлектроника 3 (163), 63-78, 2016 | 3 | 2016 |
| Adsorption isobars of fluorocarbon compounds selected for cryogenic plasma etching of low-k dielectrics AA Rezvanov, KP Mogilnikov, OP Gutshin, ES Gornev, GY Krasnikov, ... Spring Meeting and Exhibit MRS-2015, 2015 | 3 | 2015 |
| Cellular automata model of O2 plasma treatment influence on the integral properties of SiOCH low-K dielectric A Rezvanov, IV Matyushkin, OP Gutshin Electronic engineering. Series 3, 63-78, 0 | 3 | |
| Atomic layer deposition of thin films of hafnium oxide using Izofaz TM 200-01 system SS Zyuzin, YG Zasseev, AA Rezvanov, VV Panin, VA Gvozdev, ... International Conference on Micro-and Nano-Electronics 2021 12157, 400-406, 2022 | 2 | 2022 |
| Investigation of conductive filament growth and rupture in ReRAM structures based on hafnium oxide EA Ganykina, AA Rezvanov, YS Gornev International Conference on Micro-and Nano-Electronics 2021 12157, 89-94, 2022 | 2 | 2022 |
| Dielectric Barrier in the Subtractive Process of Formation of a Copper Metallization System AA Orlov, AA Rezvanov, VA Gvozdev, GA Orlov, DS Seregin, ... Russian Microelectronics 51 (6), 470-479, 2022 | 1 | 2022 |
| Исследование термических эффектов в HfO2 RRAM-структурах в процессе Reset ЕА Ганыкина, ЕС Горнев, АА Резванов Наноиндустрия 13 (S5-3), 812-815, 2020 | 1 | 2020 |
| Gas Phase Pore Stuffing for the protection of organo-silicate glass dielectric materials M Fujikawa, JF de Marneffe, R Chanson, KB Gavan, A Rezvanov, ... 2018 International Symposium on Semiconductor Manufacturing (ISSM), 1-3, 2018 | 1 | 2018 |
Mikhail BaklanovПодтвержден адрес электронной почты в домене ncut.edu.cn
