| Affordable 3D printed microwave antennas MIM Ghazali, E Gutierrez, JC Myers, A Kaur, B Wright, P Chahal 2015 IEEE 65th electronic components and technology conference (ECTC), 240-246, 2015 | 58 | 2015 |
| Affordable terahertz components using 3D printing A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2071-2076, 2015 | 35 | 2015 |
| A Multi-Layered Metamaterial-Inspired Miniaturized Dynamically-Tunable Antenna J Myers, P Chahal, E Rothwell, L Kempel IEEE, 2015 | 21 | 2015 |
| Design study of electronically steerable half-width microstrip leaky wave antennas JA Hejase, J Myers, L Kempel, P Chahal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1348-1353, 2011 | 11 | 2011 |
| Planar surface plasmonic structures for terahertz circuits and sensors P Chahal, J Myers, KY Park, C Meierbachtol, N Nair 2012 IEEE 62nd Electronic Components and Technology Conference, 930-935, 2012 | 8 | 2012 |
| A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications J Tang, JA Hejase, JC Myers, SR Connor, DM Dreps, J Kuczynski 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 6 | 2016 |
| IEEE 65th Electronic Components and Technology Conference (ECTC) A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal San Diego, CA, 26-29, 2015 | 5 | 2015 |
| Plasmonic resonance absorption spectra in mid-infrared in an array of graphene nanoresonators DC Abeysinghe, J Myers, NN Esfahani, JR Hendrickson, JW Cleary, ... Quantum Sensing and Nanophotonic Devices XI 8993, 365-371, 2014 | 5 | 2014 |
| 3D electromagnetic modelling of connector to pcb via transitions Y Zhang, JA Hejase, JC Myers, JJ Audet, WD Becker, DM Dreps 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 4 | 2018 |
| Embeded Filtering in PCB Integrated Ultra High Speed Dielectric Waveguides Using Photonic Band Gap Structures JC Myers, JA Hejase, J Tang, DM Dreps Electrical Performance Of Electronic Packaging And Systems (EPEPS), 2017 …, 2018 | 4 | 2018 |
| Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels JC Myers, JA Hejase, J Tang, S Chun, WD Becker, DM Dreps 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 3 | 2019 |
| Dielectric waveguide and coupling mechanism in a printed circuit board SR Connor, JA Hejase, J Kuczynski, JC Myers, T Junyan US Patent App. 15/295,308, 2018 | 3 | 2018 |
| High-speed bus signal integrity compliance using a frequency-domain model ST Win, J Hejase, WD Becker, G Wiedemeier, DM Dreps, JC Myers, ... 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 29-34, 2016 | 3 | 2016 |
| Design of thin-film quasi-optical terahertz components using evolutionary algorithms JC Myers, A Kaur, KY Park, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2012-2019, 2015 | 3 | 2015 |
| Investigation of modulation-capable silicon waveguides for efficient on-wafer terahertz interconnects JC Myers, A Kaur, JA Byford, P Chahal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1010-1016, 2015 | 3 | 2015 |
| Reduction of crosstalk between dielectric waveguides using split ring resonators DM Dreps, JA Hejase, JC Myers, T Junyan US Patent 10,181,628, 2019 | 2 | 2019 |
| Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board SR Connor, JA Hejase, J Kuczynski, JC Myers, T Junyan US Patent 10,141,623, 2018 | 2 | 2018 |
| Vertical and horizontal transitions of substrate integrated waveguides within a multi-layered PCB for high speed signaling applications JC Myers, JA Hejase, J Tang, PR Paladhi, WD Becker, S Chun, DM Dreps 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 2 | 2018 |
| A multi-layered metamaterial inspired dynamically tunable antenna JC Myers, P Chahal, E Rothwell Antennas and Propagation Society International Symposium (APSURSI), 2013 …, 2013 | 2 | 2013 |
| Integration of piezoelectric energy harvesting and antenna elements on a common substrate JC Myers, BS Strachan, X Yang, P Chahal 2013 IEEE 63rd Electronic Components and Technology Conference, 1662-1666, 2013 | 2 | 2013 |
Premjeet ChahalProfessor, Michigan State UniversityПодтвержден адрес электронной почты в домене msu.edu
