Wiren Becker
Wiren Becker
IBM
Подтвержден адрес электронной почты в домене ieee.org
Название
Процитировано
Процитировано
Год
When are transmission-line effects important for on-chip interconnections?
A Deutsch, GV Kopcsay, PJ Restle, HH Smith, G Katopis, WD Becker, ...
IEEE Transactions on microwave theory and techniques 45 (10), 1836-1846, 1997
4721997
Modeling, measurement, and simulation of simultaneous switching noise
BD McCredie, WD Becker
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
1351996
Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems
WD Becker, J Eckhardt, RW Frech, GA Katopis, E Klink, MF McAllister, ...
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
1051998
Self-healing chip-to-chip interface
WD Becker, DM Dreps, FD Ferraiolo, A Haridass, RJ Reese
US Patent 7,362,697, 2008
942008
Time-domain electromagnetic analysis of interconnects in a computer chip package
WD Becker, PH Harms, R Mittra
IEEE transactions on microwave theory and techniques 40 (12), 2155-2163, 1992
831992
Frequency-dependent crosstalk simulation for on-chip interconnections
A Deutsch, HH Smith, CW Surovic, GV Kopcsay, DA Webber, PW Coteus, ...
IEEE transactions on advanced packaging 22 (3), 292-308, 1999
601999
A general purpose Maxwell solver for the extraction of equivalent circuits of electronic package components for circuit simulation
R Mittra, WD Becker, PH Harms
IEEE Transactions on Circuits and Systems I: Fundamental Theory and …, 1992
581992
The importance of inductance and inductive coupling for on-chip wiring
A Deutsch, H Smith, GA Katopis, WD Becker, PW Coteus, CW Surovic, ...
Electrical Performance of Electronic Packaging, 53-56, 1997
561997
System for airflow management in electronic enclosures
WD Becker, JP Corrado, EE Cruz, MJ Fisher, GF Goth
US Patent 7,113,401, 2006
542006
FDTD modeling of noise in computer packages
WD Becker, R Mittra
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994
481994
Efficient modeling of power planes in computer packages using the finite difference time domain method
R Mittra, S Chebolu, WD Becker
IEEE transactions on microwave theory and techniques 42 (9), 1791-1795, 1994
421994
MCM technology and design for the S/390 G5 system
GA Katopis, WD Becker, TR Mazzawy, HH Smith, CK Vakirtzis, ...
IBM Journal of Research and Development 43 (5.6), 621-650, 1999
361999
Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system
CC Hwang, WD Becker, TG Mcnamara, CL Tong
US Patent 7,826,579, 2010
332010
Programmable driver delay
WD Becker, A Haridass, BG Truong
US Patent 7,233,170, 2007
292007
Power distribution modelling of high performance first level computer packages
W Becker, B McCredie, G Wilkins, A Iqbal
Proceedings of IEEE Electrical Performance of Electronic Packaging, 202-205, 1993
281993
First-and second-level packaging of the z990 processor cage
TM Winkel, WD Becker, H Harrer, H Pross, D Kaller, B Garben, ...
IBM Journal of Research and Development 48 (3.4), 379-394, 2004
262004
First-and second-level packaging for the IBM eServer z900
H Harrer, H Pross, TM Winkel, WD Becker, HI Stoller, M Yamamoto, S Abe, ...
IBM Journal of Research and Development 46 (4.5), 397-420, 2002
252002
First-and second-level packaging for the IBM eServer z900
H Harrer, H Pross, TM Winkel, WD Becker, HI Stoller, M Yamamoto, S Abe, ...
IBM Journal of Research and Development 46 (4.5), 397-420, 2002
252002
Early high level net based analysis of simultaneous switching
CK Vakirtzis, GA Katopis, GW Mahoney, CR Selinger, BD McCredie, ...
US Patent 5,477,460, 1995
251995
Mid-frequency simultaneous switching noise in computer systems
W Becker, H Smith, T McNamara, P Muench, J Eckhardt, M McAllister, ...
1997 Proceedings 47th Electronic Components and Technology Conference, 676-681, 1997
241997
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