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Co-authors
- Henning HeuerProf. Dr.-Ing., TU Dresden, Fraunhofer IKTS DresdenVerified email at ikts.fraunhofer.de
- Bernd KöhlerSenior Scientist, Matrial Diagnostics, Fraunhofer IKTSVerified email at ikts.fraunhofer.de
- Klaus-Juergen WolterProfessor für Verfahrenstechnologie der Elektronik, TU DresdenVerified email at tu-dresden.de
- Udo NetzelmannFraunhofer Institute for Nondestructive TestingVerified email at izfp.fraunhofer.de
- Gerd DobmannScience NDTVerified email at dozent.di-uni.de
- Martin OppermannTechnische Universität DresdenVerified email at zmp.et.tu-dresden.de
- Issa HakimPh.DVerified email at purdue.edu
- Kopycinska Mueller, MalgorzataIKTS-MDVerified email at ikts-md.fraunhofer.de
- Jürgen SchreiberFraunhofer-Institut IKTS-MDVerified email at ikts-extern.fraunhofer.de
- Leonard J. BondProfessor, Iowa State UniversityVerified email at iastate.edu
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Norbert G Meyendorf
Professor Materials Engineering, University of Dayton
Verified email at udayton.edu