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Andreas C Fischer
Andreas C Fischer
Ph.D. from KTH Royal Institute of Technology in Stockholm, Sweden
Verified email at ee.kth.se
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Cited by
Cited by
Year
Handbook of silicon based MEMS materials and technologies
M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Krockel, ...
William Andrew, 2015
669*2015
Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
4072013
Integrating MEMS and ICs
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 2015
388*2015
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
3102015
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
1332016
Pressure sensors based on suspended graphene membranes
AD Smith, S Vaziri, F Niklaus, AC Fischer, M Sterner, A Delin, M Östling, ...
Solid-State Electronics 88, 89-94, 2013
902013
Unconventional applications of wire bonding create opportunities for microsystem integration
AC Fischer, JG Korvink, N Roxhed, G Stemme, U Wallrabe, F Niklaus
Journal of Micromechanics and Microengineering 23 (8), 083001, 2013
852013
Graphene-based CO 2 sensing and its cross-sensitivity with humidity
AD Smith, K Elgammal, X Fan, MC Lemme, A Delin, M Råsander, ...
RSC advances 7 (36), 22329-22339, 2017
782017
Flexible and stretchable microneedle patches with integrated rigid stainless steel microneedles for transdermal biointerfacing
M Rajabi, N Roxhed, RZ Shafagh, T Haraldson, AC Fischer, W Wijngaart, ...
PloS one 11 (12), e0166330, 2016
772016
High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires
AC Fischer, SJ Bleiker, N Somjit, N Roxhed, T Haraldsson, G Stemme, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 541-547, 2012
58*2012
High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires
FN Simon J Bleiker, Andreas C Fischer, Umer Shah, Nutapong Somjit, Tommy ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015
48*2015
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus
Journal of Micromechanics and Microengineering 22 (10), 105001, 2012
462012
CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration
FN Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland, Stian Martinsen ...
Selected Topics in Quantum Electronics, IEEE Journal of 21 (4), 1-11, 2015
41*2015
3D Free‐Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching
AC Fischer, LM Belova, YGM Rikers, BG Malm, HH Radamson, ...
Advanced Functional Materials 22 (19), 4004-4008, 2012
372012
Chapter 26: Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS
AC Fischer, M Mäntysalo, F Niklaus, M Tilli, T Motooka, VM Airaksinen, ...
Handbook of Silicon Based MEMS Materials and Technologies (Second Edi􏰀on), 2015
33*2015
Low-cost uncooled microbolometers for thermal imaging
N Roxhed, F Niklaus, AC Fischer, F Forsberg, L Höglund, P Ericsson, ...
Proc. SPIE, 772611, 2010
302010
Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires
AC Fischer, N Roxhed, T Haraldsson, N Heinig, G Stemme, F Niklaus
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International …, 2011
262011
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays
F Forsberg, N Roxhed, AC Fischer, B Samel, P Ericsson, N Hoivik, ...
Infrared physics & technology 60, 251-259, 2013
222013
Wire-bonded through-silicon vias with low capacitive substrate coupling
AC Fischer, M Grange, N Roxhed, R Weerasekera, D Pamunuwa, ...
Journal of Micromechanics and Microengineering 21, 085035, 2011
222011
Stress-Minimized Packaging of Inertial Sensors by Double-Sided Bond Wire Attachment
SH Stephan Schroder, Frank Niklaus, Alexandra Nafari, Eskild R Westby ...
Microelectromechanical Systems, Journal of 24 (4), 781-789, 2015
20*2015
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