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Co-authors
- Ryan DehoffOak Ridge National LaboratoryVerified email at ornl.gov
- Sudarsanam BabuUniversity of Tennessee, Knoxville & Oak Ridge National Laboratory, Oak RidgeVerified email at utk.edu
- Amit ShyamOak Ridge National LaboratoryVerified email at ornl.gov
- Benjamin StumpOak Ridge National LaboratoryVerified email at ornl.gov
- Sumit BahlOak Ridge National LaboratoryVerified email at ornl.gov
- Kevin SiscoPost Doc, University of SydneyVerified email at sydney.edu.au
- Ying YangOak Ridge National LabVerified email at ornl.gov
- Peeyush NandwanaOak Ridge National LaboratoryVerified email at ornl.gov
- Gerald L. KnappOak Ridge National LaboratoryVerified email at ornl.gov
- Matthew John M. KraneProfessor of Materials Engineering, Purdue UniversityVerified email at purdue.edu
- John ColemanOak Ridge National LaboratoryVerified email at ornl.gov
- Vincent C PaquitSection Head - Secure & Digital Manufacturing @ Oak Ridge National LaboratoryVerified email at ornl.gov
- Narendran RaghavanScientist, BoeingVerified email at boeing.com
- Matt RolchigoOak Ridge National LaboratoryVerified email at ornl.gov
- Niyanth SridharanLincoln Electric CompanyVerified email at lincolnelectric.in
- John A. TurnerOak Ridge National Laboratory (ORNL)Verified email at pobox.com
- David DunandNorthwestern UniversityVerified email at northwestern.edu
- Kyle FeziFort Wayne MetalsVerified email at fwmetals.com
- James A. HaynesResearch Consortium Manager, Oak Ridge National LaboratoryVerified email at ornl.gov
- Sophie PrimigUNSW SydneyVerified email at unsw.edu.au